Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wireless ic device

A wireless and device technology, applied in the field of wireless IC devices, can solve the problems of increasing return loss, hindering the action of RF-ID tags, and interfering with electromagnetic fields, and achieves miniaturization, reduced occupation area, and excellent radiation characteristics.

Inactive Publication Date: 2009-10-28
MURATA MFG CO LTD
View PDF1 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The second antenna 66 consumes energy due to resonance in the near electromagnetic field generated by the antenna unit, so the return loss becomes large.
In this case, there is a problem that the electromagnetic field generated by the resonant tag interferes with the electromagnetic field on the side of the RF-ID tag, thereby hindering the operation of the RF-ID tag.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wireless ic device
  • Wireless ic device
  • Wireless ic device

Examples

Experimental program
Comparison scheme
Effect test

no. 2 Embodiment approach 》

[0074] Figure 4 It is a plan view of the wireless IC device of the second embodiment. figure 2 In the example shown, the linear radiation electrode 33 is formed along one side of the spiral line electrode portion 22 and one side of the substrate 21, but this Figure 4 In the example shown, the shape of the radiation electrode 33 is different from this. Figure 4 In the example (A), the radiation electrode 33 a has a folded shape so as to reciprocate along one side of the line electrode portion 22 and one side of the base material 21 .

[0075] in addition Figure 4 In the example of (B), the radiation electrode 33 b is formed in a linear shape along one side of the substrate 21 and in a direction away from the radiation / resonance common electrode 20 .

[0076] and in Figure 4 In the example (C), the radiation electrode 33 c is formed in an L-shape along both sides of the base material 21 .

[0077] about Figure 4 The structure and function other than the above are th...

no. 3 Embodiment approach 》

[0082] Figure 5 It is a configuration diagram showing the wireless IC device of the third embodiment, (A) is a plan view, and (B) is a cross-sectional view of its main part. figure 2 In the example shown, various electrodes are respectively formed on the upper surface and the lower surface of the base material 21, and capacitors are formed in the capacitance electrode portions facing each other across the base material 21. However, in this Figure 5 In the shown example, only the upper surface of the substrate 21 is used to form the circuit. That is, on the upper surface of the base material 21, a spiral-shaped line electrode portion 22 and a capacitor electrode portion 23 connected to the inner peripheral end are respectively formed. These electrodes are covered with an insulating layer 27, and the upper surface of the insulating layer 27 is connected to the capacitor electrode portion 23. A capacitive electrode portion 24 is formed at a position facing the electrode porti...

no. 4 Embodiment approach 》

[0086] Image 6 It is a plan view of the wireless IC device of the fourth embodiment, Figure 7 is a cross-sectional view of the electromagnetic coupling module 30 used in the wireless IC device 104 .

[0087] The electromagnetic coupling module 30 is constituted by a feeder circuit board 32 and a wireless IC chip 34 mounted thereon. In the first to third embodiments, the two connection terminals formed on the wireless IC 31 are directly connected to the radiation / resonance common electrode 20 and the radiation electrode 33, respectively. Image 6 In the example shown, electromagnetic coupling is performed with the radiation / resonance common electrode 20 and the radiation electrode 33, respectively.

[0088] Such as Figure 7As shown, capacitive electrodes 14aa, 14ab, 14ba, 14bb and inductance conductors 13a, 13b are formed inside the feed circuit board 32, respectively. Electrode pads for connecting capacitor electrodes 14aa and 14ba are formed on the upper surface of fee...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wireless IC device including a spiral line electrode portion and a first capacitance electrode connected to the inner end of the line electrode portion, which are disposed on the top surface of a substrate. A second capacitance electrode opposing the first capacitance electrode and a cross line electrode, which connects the second capacitance electrode and a connecting portion that connects the top and bottom surfaces, are disposed on the bottom surface of the substrate. The connecting portion electrically connects the outer end of the line electrode portion and an end of the cross line electrode. A wireless IC is mounted such that terminal electrodes thereof are connected to the connecting portion and an end of a radiating electrode. A radiating / resonating electrode including the line electrode portion, the capacitance electrodes, and the cross line electrode can act both as a resonant circuit for a resonant tag and as a radiating electrode serving as an RFID tag.

Description

technical field [0001] The present invention relates to a wireless IC device, and more particularly to a wireless IC device using an RF-ID (Radio Frequency Identification: Radio Frequency Identification) system for performing data communication in a non-contact manner using electromagnetic waves. Background technique [0002] In recent years, the RF-ID system, which performs non-contact communication between a reader-writer that generates an induced electromagnetic field and an RF-ID tag attached to an item and stores predetermined information, is often used as an item management system , to transmit information. In addition, Patent Document 1 shows a composite marker having an RF-ID marker and a resonance marker. [0003] figure 1 It is a figure which shows the example of the structure of the composite mark shown in this patent document 1. As shown in the figure, in the RF-ID tag 60 , the outer periphery of the embedded (inlet) sheet 61 is protected by the cover sheet 62...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07G06K19/00H01Q1/38H01Q5/00H01Q7/00H01Q9/27H01Q21/30H04B5/02G06K7/08G06K7/10G06K19/077H01Q1/40H01Q1/50H01Q5/10H01Q5/321H01Q5/342
CPCH01Q1/36H01Q1/2225G06K19/07749G06K19/07767
Inventor 池本伸郎加藤登
Owner MURATA MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com