Resin composition with high thermal conductivity, no halogen and difficult fire retardance and pre-impregnated body and coating material thereof

A resin composition, high thermal conductivity technology, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of undisclosed flame retardant characteristics, unmentioned high thermal conductivity characteristics, etc., to improve service life and stability, high Effects of thermal conductivity, excellent heat resistance and flame resistance

Inactive Publication Date: 2009-11-18
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Japanese Patent Laid-Open No. 5-267808 discloses a thermally conductive insulating layer for metal substrates. Although it meets the requirements of high thermal conductivity, it does not disclose whether this material has the flame retardancy of UL94-V0, and is only suitable for single laminates; in addition, although US Patent No. 6,187,416 is a halogen-free and phosphorus-free resin, it does not mention whether it has high thermal conductivity and meets the UL94-V0 flame retardant standard

Method used

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  • Resin composition with high thermal conductivity, no halogen and difficult fire retardance and pre-impregnated body and coating material thereof
  • Resin composition with high thermal conductivity, no halogen and difficult fire retardance and pre-impregnated body and coating material thereof
  • Resin composition with high thermal conductivity, no halogen and difficult fire retardance and pre-impregnated body and coating material thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] The phosphorus-based epoxy resin (EEW=350g / eq of 75 parts by weight of solid type, Nanya Plastics Co., Ltd., product name: NPEP-200LA70, phosphorus content=2.6wt%), the bisphenol A type epoxy resin of 25 parts by weight ( EEW=186g / eq, South Asia Plastics Company, product name: NPEL-182E), the phenolic resin of 34.87 parts by weight and the 2-methylimidazole of 0.05 parts by weight, after being dissolved in 207.5 parts by weight of butanone, blending 250.5 parts by weight of high Thermally conductive powder, that is, a high thermally conductive halogen-free flame retardant composition (high thermally conductive powder accounts for 65%).

[0072] Among them, the high thermal conductivity powder (250.5 parts by weight) mixed into the above resin liquid is used to obtain the closest packing model of the high thermal conductivity powder by using the Horsfield model, and the specific ratio is 45.09 parts by weight of spherical alumina A (average particle diameter D50=5 μm), 5...

Embodiment 2

[0076] The resin solution formula in Example 1 was changed to blending 539.5 parts by weight of high thermal conductivity powder (accounting for 80% of the high thermal conductivity halogen-free flame retardant composition), and the Horsfield model was used to obtain the closest packing model of the high thermal conductivity powder, which The specific ratio is 97.11 parts by weight of spherical alumina A (average particle diameter D50=5 μm), 10.79 parts by weight of spherical alumina B (average particle diameter D50=0.5 μm) and 431.6 parts by weight of boron nitride (average particle diameter Diameter D50=5.5μm), where the actual packing curve of alumina powder is compared with the theoretical closest packing curve as figure 1 .

[0077] The physical properties of the prepared copper foil substrate were tested, and the results are shown in Table 1.

Embodiment 3

[0079] The formula of the resin solution is the same as that in Example 2, but the solid content of the resin solution is adjusted to 75wt%, and then coated on a 35 μm copper foil to form an adhesive-backed copper foil (RCC) with a coating thickness of 100 μm, and then laminated on the resin surface with a thickness of 35 μm The copper foil was laminated under the same conditions as in Example 1. Finally, the physical properties of the copper foil substrate were tested after the copper foil was etched. The results are shown in Table 1.

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Abstract

The invention relates to a resin composition with high thermal conductivity, no halogen and fire retardance, which is applied to a printed circuit board and used as a thermal-conduction insulating layer. The resin composition comprises 5 to 70 weight percent of phosphorus epoxy resin, 0 to 50 weight percent of epoxy resin with a plurality of functional groups or double functional groups, 1 to 20 weight percent of hardening agent, 0.01 to 10 weight percent of accelerant, 0 to 20 weight percent of inorganic powder, 5 to 85 weight percent of high thermal-conduction powder and 0 to 10 weight percent of processing additive; in addition to high thermal conductivity, excellent thermal resistance and fire retardance, the resin composition does not contain a halogenous fire retardant and does not generate toxic or corrosive gas in combustion and is an environment-friendly material; the resin composition can be prepared into a pre-impregnated body with high thermal conductivity through an impregnation method or prepared into a coating material with high thermal conductivity by a coating method; the pre-impregnated body or the coating material is applied as the thermal-conduction insulating layer of the printed circuit board so that the printed circuit board has high thermal conductivity and is favorable for rapidly dissipating heat generated in the operation of electronic components of the printed circuit board to prolong the life service and the stability of the electronic components.

Description

technical field [0001] The invention relates to a resin composition, especially a resin composition which has both halogen-free flame retardancy and high thermal conductivity, and is used as a heat conduction insulating layer on a printed circuit board. Background technique [0002] In order to meet the flame retardant standard of UL94-V0, the traditional FR4 printed circuit board will use propanediol tetrabromide to react with excess epoxy resin to form epoxy resin at both ends, then add hardener and accelerator, impregnate Heat hardening of glass fibers gives it flame retardancy. In addition, propanediol tetrabromide can also be mixed with other epoxy resin hardeners to carry out curing reaction with epoxy resin to endow the cured epoxy resin with flame retardancy. And because propanediol tetrabromide is a halogen flame retardant, it will produce dioxin (dioxin) or benzofuran (benzofuran) and irritating, corrosive harmful gases when burning, and small molecule smoke suppr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08K3/22C08K3/38H05K1/03
Inventor 冯殿润廖德超陈豪升
Owner NANYA PLASTICS CORP
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