Novel multilayer transparent conductive film structure and preparation method thereof
A transparent conductive film, a new type of technology, applied in coatings, circuits, electrical components, etc., can solve the problems of slow film growth, increased equipment complexity, and no suede structure on the film surface
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Embodiment 1
[0019] Sequential Preparation of SiO by Online APCVD Process on Float Glass 2 Thin film and FTO thin film, deposited at 600°C, SiO 2 The thickness of the film layer is 70 nanometers, and the thickness of the FTO film layer is 500 nanometers. According to the characteristics of the process, it can be known that the FTO film prepared by online APCVD is a film with a suede structure. The substrate temperature of the sputtering equipment is 350 degrees Celsius. Float glass The area with a temperature of 350° C. in the cooling zone of the production line is directly connected to the loadlock chamber of the sputtering equipment. The glass of the float glass production line is transported to this area, that is, when the glass temperature drops to 350°C, it directly enters the sample chamber of the sputtering equipment, and then is transported into the process chamber of the sputtering equipment to deposit Al-doped ZnO For the thin film, the target material used is a 1wt% Al-doped Zn...
Embodiment 2
[0021] SiO 2 The preparation of the film is the same as in Example 1. The FTO film layer is also prepared by online APCVD equipment, with a thickness of 300 nanometers. The FTO film prepared by this online APCVD is a film with a textured structure. At this time, the substrate temperature of the sputtering equipment is 200 ° C, and the float glass production line The cooling zone with a temperature of 200° C. is directly connected to the loadlock chamber of the sputtering device. The glass of the float glass production line is transported to this area, that is, when the glass temperature drops to 200°C, it is directly transported into the sample chamber of the sputtering equipment, and then transported into the process chamber of the sputtering equipment to deposit Ga-doped For the ZnO thin film, the target used is a 0.57wt% Ga-doped ZnO target. The Ga-doped ZnO thin film has a thickness of 300 nm.
Embodiment 3
[0023] SiO 2 The preparation of the thin film and the FTO film layer is the same as in the second embodiment, the deposition temperature is also 200° C., the target used is a 0.8 wt % Zr-doped ZnO target, and the thickness of the Zr-doped ZnO film is 100 nanometers.
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