Probe of vertical probe card

Abstract

The invention discloses a probe of a vertical probe card. The invention mainly has the technical means that a surface about 1 to 10 mil of a probe tip of the vertical probe card is plated with a 1 to 20 nanometers thick coating film of high conductivity polymer material. By the coating film, the nanometer coating film on the vertical probe can effectively make the probe have superior qualities of no viscosity, high conductivity, reduced contact force and prolonged service life, improving the yield of the wafer test, reducing the cleaning frequency of the probe, and lowering the overall test cost.

Description

technical field [0001] The invention relates to a probe card (Probe Card) used for wafer probe (Wafer Probe) testing, in particular to a probe of a vertical probe card with a conductive polymer nano-coating film. Background technique [0002] A probe card (Probe Card) is a structure composed of a multilayer printed circuit board (PCB), some of which have more than 30 layers. Its structure is complex and uses many probes (Probe) to individually contact (probe) a series of electronic contacts on the wafer. (Spacer), the point of contact between each probe and the wafer, is far smaller than a hair. The probe card is used before the integrated circuit (IC) is packaged. For the die cut from the wafer (Wafer), the probe is used to perform a functional test on the die to screen out unqualified products. Then carry out the encapsulation project afterwards. Therefore, wafer probing is one of the important processes in integrated circuit manufacturing that has a considerable impact ...

AI Technical Summary

Problems solved by technology

Using the solution of increasing the contact force, although it will have a certain effect on maintaining the test yield, it is easy to damage the underlying structure of the grains to be tested, especially in advanced wafer manufacturing technologies (0.13um, 90nm, 65nm... etc.) When introducing fragile low-k dielectrics materials, it will be required that the wafer needle measurement technology cannot deform or damage the low-k dielectrics materials and their underlying materials or structures

However, if cleaning probes are used as a solution, the frequency of cleaning probes (clearing frequency) may increase rapidly due to the increase in the number of probes or the decrease in the distance between probes, and the use of the test machine will be reduced. rate and reduce probe life

[0005] Existing vertical probe cards generally have the problem that the probes are easy to stick. Although the industry has developed a method of coating the surface of the probes with a metal coating in recent years, this method can only solve the problem of the life of the probes. However, the problem of probe sticking cannot be solved, so the problem of improving test yield and test stability is still unsolved

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