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Semiconductor device, and manufacturing method therefor

A manufacturing method and semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of unexplained coating (wetting and expansion, etc.)

Active Publication Date: 2009-12-02
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent Document 3 discloses measures against overflow of underfill material, but fails to address the problem of application (wettability and spreadability) of underfill material at corners

Method used

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  • Semiconductor device, and manufacturing method therefor
  • Semiconductor device, and manufacturing method therefor
  • Semiconductor device, and manufacturing method therefor

Examples

Experimental program
Comparison scheme
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no. 1 approach

[0055] figure 1 It is a plan view showing an example of the structure of the semiconductor device according to the first embodiment of the present invention through a sealing assembly. figure 2 is a cross-sectional view, showing the figure 1 An example of a structure observed in line A-A. image 3 is a partially enlarged cross-sectional view, showing the figure 2 An example of the structure shown in Part A. Figure 4 is a top view, showing the figure 1 An example of a substrate structure included in a semiconductor device is shown. Figure 5 is a partially enlarged top view, showing the Figure 4 An example of the structure shown in Part A. Figure 6 is a partial cross-sectional view, showing the Figure 4 An example of a substrate structure is shown. Figure 7 is a partially enlarged cross-sectional view, showing the Figure 6 An example of the structure shown in Part A.

[0056] Figures 1 to 3 The semiconductor device according to the illustrated first embod...

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PUM

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Abstract

The present invention provides a semiconductor device with improved reliability. The semiconductor device includes a wiring board, a microcomputer chip flip-chip bonded over the wiring board via gold bumps, a first memory chip laminated over the microcomputer chip, wires for coupling the first memory chip to the wiring board, an underfill material with which a flip-chip coupling portion of the microcomputer chip is filled, and a sealing member for sealing the microcomputer chip and the first memory chip with resin. Further, the corner of a second opening portion of a solder resist film of thewiring board corresponding to the corner of the chip on the air vent side in charging the underfill material is made close to the microcomputer chip, which can improve the wettability and spread of the underfill material at the second opening portion, thus reducing the exposure of leads to the second opening portion, thereby improving the reliability of the semiconductor device.

Description

[0001] (Cross-reference to related application) [0002] The disclosure of Japanese Patent Application No. 2008-141285 filed on May 29, 2008 including its specification, drawings and abstract is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to a semiconductor device and a method of manufacturing the same, and more particularly, to a semiconductor device packaged by filling a flip-chip bonded semiconductor chip with an underfill material. Background technique [0004] A component for surface mounting to be mounted on a substrate has a plurality of protruding electrodes arranged alternately. A substrate for surface mounting has a plurality of bonding pads formed on a substrate base corresponding to protruding electrodes. In a disclosed structure, each bonding pad includes a pad portion having a predetermined uniform width, and a tip (tip) extending from the pad to a column of bonding pads (for example, see Patent Docu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L23/48H01L23/482H01L23/16H01L23/544H01L21/48H01L21/50H01L21/60H01L21/54
CPCH01L2225/1058H01L2224/73203H01L23/3128H01L2224/814H01L2224/16H01L2924/01019H01L2225/1023H01L2924/15311H01L21/563H01L2224/48091H01L2224/81191H01L2224/32225H01L23/49816H01L2224/73204H01L24/48H01L2924/01079H01L25/105H01L25/0657H01L2224/48227H01L2225/06517H01L23/49838H01L2225/0651H01L25/03H01L2924/01078H01L2924/01057H01L2224/45144H01L2224/16225H01L24/97H01L2224/32145H01L2224/73265H01L2224/97H01L2924/15331H01L2224/45015H01L2924/181H01L2924/00014H01L24/45H01L24/73H01L2924/14H01L2224/05026H01L2224/05568H01L2224/05001H01L2224/48095H01L2224/0615H01L2924/00H01L2924/014H01L2924/00012H01L2224/85H01L2224/83H01L2224/81H01L2224/05599H01L2224/05099
Inventor 太田祐介杉山道昭石川智和冈田三香子
Owner RENESAS ELECTRONICS CORP