Hollow polyhedral metal auto-radiating circuit board

A circuit substrate and metal plate technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., to achieve the effects of operational reliability, reduced material usage, and refined structure

Inactive Publication Date: 2009-12-09
NANJING NADI OPTOELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It mainly overcomes and solves the problem of light attenuation caused by heat generation in the existing LEDs when emitting light. Using a hollow multi-curved metal plate instead of the LED circuit substrate can effectively control the heat generation of the LED when it is emitting light, which reduces the cause of light attenuation of the LED and improves the light emission. Body life

Method used

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Embodiment Construction

[0006] The technology of making the light-weight non-ferrous metal plate above 0.1MM that can be cold-worked into a hollow "I" or "W" multi-faceted metal plate above 1.0MM, the area can be large or small, and the shape can meet the heat dissipation required by the product when it emits light. Require. Then choose one side of the hollow multi-faceted metal plate processed above to be bonded and leveled and processed technically. Then, on the flat side, the circuit core board is made and the LED lamp beads are welded. It can be designed according to the power demand, and the hollow multi-curved metal substrate is highly integrated into thin, ultra-thin or thickened types. In this way, the metal plate processing circuit directly plays the role of heat conduction and heat dissipation. The hollow multi-faceted metal self-dissipating circuit substrate can quickly dissipate heat. The principle is that according to the thermal resistance formula of the material Rth=L / λS where: L is ...

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PUM

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Abstract

The invention is a hollow polyhedral metal auto-radiating circuit board which can effectively solve the problems of LED radiating and light attenuation. The invention comprises the following steps: a traditional metal base plate is changed into a hollow metal base plate the middle of which is in polyhedral column type; one side of the hollow metal base plate is leveled as a manufacturing surface of the circuit board; the shape of the hollow polyhedral metal auto-radiating circuit board can be designed in U-shaped or abnormal shape, slim shape or thickening shape according to the design requirements; the circuit board can be processed at will on the premise of adding no additional processes according to the product profile and the cambered surface requirement of the reflection surface to solve the problem of a plurality of reflection angles like streetlights. In the invention, the original massive cast aluminum is changed into an internal heat abstractor which is light, slim and flexible and has small volume and large area, and the internal heat abstractor consists of a polyhedral metal base plate and an insulating circuit layer; the polyhedral metal base plate can be processed into a circuit core board, the radiating surface of the base plate can be integral with the circuit core board, so one side of the integrated structure can radiate heat, the other side of the integrated structure can be as a circuit and the integrated structure close to lamp; the hollow column can form convection with outside air to realize the effect of efficient radiating heat.

Description

Technical field: [0001] The invention relates to a lamp head device with self-radiating LED light-emitting circuit substrates. The device is composed of LED light-emitting diodes, circuit substrates, heat dissipation plates and other components. Self-dissipating circuit substrate. Background technique: [0002] LED lamps are new energy-saving products in recent years, and the problem of light decay is difficult to solve. The main cause of light decay is the heat and heat dissipation of LED lights when they emit light. LED manufacturers in the same industry have tried various methods to solve the problems of light decay and heat dissipation, but there is no better solution and process. At present, some LED light source manufacturers use aluminum circuit boards as substrates and external cast aluminum shells for heat conduction and heat dissipation. The disadvantage of this heat conduction and heat dissipation is that the circuit substrates cannot directly dissipate heat and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00H01L23/36F21Y101/02F21V29/74F21Y115/10
Inventor 丁小礼
Owner NANJING NADI OPTOELECTRONICS CORP
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