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High thermal conductivity metal base circuit board and preparing method thereof

A metal-based circuit board, metal substrate technology, applied in the direction of printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve the problems of complex preparation process, poor heat dissipation performance, large process pollution, etc. Effects of thermal shock performance, improved stability, high insulation performance

Inactive Publication Date: 2015-12-02
SHENZHEN LAITENING NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the first aspect of the embodiment of the present invention provides a metal-based circuit board with high thermal conductivity to solve the problems of poor heat dissipation performance, complicated preparation process, and large process pollution of the existing metal-based circuit board, and to solve the problem that the existing technology cannot achieve Difficulties in making special-shaped circuits on metal substrates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] A method for preparing a metal-based circuit board with high thermal conductivity, comprising the following steps:

[0087] (1) The mixture of polyethylene terephthalate and polybutylene terephthalate with a mass ratio of 2:3 is mixed in proportion with co-solvent isopropanol, fully stirred and reacted completely to obtain a slurry; Take alumina, aluminum nitride and boron nitride powders, grind and mix them thoroughly to obtain a mixture of alumina, aluminum nitride and boron nitride powders. Mix the mixture of aluminum oxide and boron nitride powder with the slurry obtained above, then add diluent acetone and curing agent, stir and disperse evenly at 220r / min, and then obtain a high thermal conductivity and high insulation coating. The above raw materials are formulated according to the following mass percentages: Specific mixing: 50% mixture of polyethylene terephthalate and polybutylene terephthalate; 40% mixture of aluminum oxide, aluminum nitride and boron nitride...

Embodiment 2

[0092] A method for preparing a metal-based circuit board with high thermal conductivity, comprising the following steps:

[0093] (1) The mixture of polyethylene terephthalate and polybutylene terephthalate with a mass ratio of 2:3 is mixed with cosolvent n-butanol in proportion, fully stirred and reacted completely to obtain a slurry; Take alumina, aluminum nitride and boron nitride powders, grind and mix them thoroughly to obtain a mixture of alumina, aluminum nitride and boron nitride powders. Mix the aluminum oxide and boron nitride powder mixture with the slurry obtained above, then add diluent n-butanol and curing agent, stir and disperse evenly at 220r / min, and then obtain a high thermal conductivity and high insulation coating. The above raw materials are in the following mass percentages Content ratio mixing: 50% mixture of polyethylene terephthalate and polybutylene terephthalate; 35% mixture of aluminum oxide, aluminum nitride and boron nitride powder; co-solvent: ...

Embodiment 3

[0098] A method for preparing a metal-based circuit board with high thermal conductivity, comprising the following steps:

[0099] (1) Mix the mixture of polyethylene terephthalate and polybutylene terephthalate with a mass ratio of 2:5 and co-solvent ethylene glycol ethyl ether in proportion, fully stir the reaction to complete, and obtain the slurry ; Take alumina, aluminum nitride and boron nitride powders, grind and mix them thoroughly to obtain a mixture of alumina, aluminum nitride and boron nitride powders, protect the alumina, aluminum nitride and boron nitride powders at a temperature of 80°C in a nitrogen atmosphere, and Mix the aluminum nitride and boron nitride powder mixture with the slurry obtained above, add diluent ethyl acetate and curing agent, stir and disperse evenly at 220r / min, and then obtain a high thermal conductivity and high insulation coating. The above raw materials are as follows: Content ratio mixing: 60% mixture of polyethylene terephthalate and...

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Abstract

The invention provides a high thermal conductivity metal base circuit board and a preparing method thereof. The circuit board comprises a metal base plate, a thermal conducting insulation layer arranged on the surface of the metal base plate, and a circuit formed on the thermal conducting insulation layer. The material of the thermal conducting insulation layer includes paint with following components by mass percentage: 40-60% by mass of a mixture of polyethylene glycol terephthalate and polybutylene terephthalate; 30-40% by mass of a mixture of aluminum oxide, aluminium nitride and boron nitride powder; 5-10% by mass of cosolvent; 3-10% by mass of diluent; and 0.5-1% by mass of curing agent. The above mentioned components account for 100% of the total mass percentage content. The heat conduction coefficient of the metal base circuit board ranges from 5W / k.M to 15W / k.M, enabling the metal base circuit board to achieve effective heat conduction, and therefore, the stability and service lifetime of an electronic component can be improved. It is also possible to make a circuit, including an abnormal-shaped circuit on a metal carrier, providing a new method to attain circuit boards of different purposes. The invention also provides a preparing method for such high thermal conductivity metal base circuit board.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a metal-based circuit board with high thermal conductivity and a preparation method thereof. Background technique [0002] In the existing circuit boards, the metal substrates and ceramic substrates used have obvious defects. Among them, the ceramic substrates do not have good machinability due to the fragile characteristics of ceramics, and require laser cutting or direct high-temperature sintering to form, and the processing cost is high. , and high-temperature sintering is also required in the circuit manufacturing process, so the energy consumption is very high, and it is not environmentally friendly, which makes it impossible to use in large quantities in the circuit board industry; while metal substrates (such as aluminum substrates, stainless steel substrates) have poor thermal conductivity and insulation. Not good, (for example, the thermal conductivity of the aluminum subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/05H05K3/00
CPCH05K1/0209H05K1/056H05K3/0011H05K2201/0145H05K2203/107
Inventor 王晓群陈镖
Owner SHENZHEN LAITENING NEW MATERIAL TECH
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