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Polymer matrix composite and preparation method thereof

A technology for composite materials and polymers, which is applied in the field of preparing "sandwich" structure multi-layer polymer-based composite materials, which can solve the problems of difficult preparation of high thermal conductivity and low dielectric properties, and achieve easy control of process parameters and low manufacturing cost , the effect of simple operation

Inactive Publication Date: 2016-12-07
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the present invention provides a kind of polymer-based composite material, also provides the preparation method of this polymer-based composite material, in order to solve the problem that the composite material with polymer material as the base material is difficult to prepare in the prior art and has high thermal conductivity , Defects of low dielectric electronic packaging insulating materials

Method used

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  • Polymer matrix composite and preparation method thereof
  • Polymer matrix composite and preparation method thereof
  • Polymer matrix composite and preparation method thereof

Examples

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Effect test

Embodiment 1

[0049] A polymer-based composite material, using PVA as a polymer matrix, surface-modified silver nanofibers coated with a PDA shell and surface-modified silver nanoparticles coated with a PDA shell as nano-scale metal fillers, nano-scale metal The filler is dispersed in the polymer matrix, wherein, in the polymer matrix composite material, the polymer matrix accounts for 97% by mass, the nanoscale metal filler accounts for 3% by mass, and the nanoscale metal filler contains The mass ratio of silver nanofibers coated with PDA shell to silver nanoparticles coated with PDA shell is 1:1.

Embodiment 2

[0051] Preparation of a single-layer polymer matrix composite with "point-line" structure

[0052] The preparation method of the polymer-based composite material of the "point-line" structure is as follows:

[0053] (1) Synthesis of silver nanofibers, specific synthesis method references: Chen C, Tang Y, Ye Y S, et al. High-performance epoxy / silica coated silver nanowire composites as underfill material for electronic packaging [J]. Composites Science and Technology, 2014, 105:80-85. The diameter of the synthesized silver nanofiber is between 100 nanometers and 200 nanometers, and the aspect ratio is 10:1 to 20:1, and the scanning electron micrograph of the silver nanofiber of gained is as follows figure 1 shown by figure 1 It can be seen that the shape of the prepared silver nanofibers is regular and linear, the average diameter is about 100nm, the aspect ratio is moderate and the dispersion is good, and there is no obvious agglomeration phenomenon;

[0054] (2) Select sui...

Embodiment 3

[0060] Preparation of a "sandwich" structured multilayer polymer matrix composite

[0061] On the basis of Example 2, the single-layer polymer-based composite material prepared in Example 2 was brittlely fractured with liquid nitrogen, and then a composite material with a suitable size was selected for lamination treatment and then placed in a high-temperature heat sink with a diameter of 25 mm. Press the mold into the mold, then put the mold into a vacuum oven and heat it to 180°C, and at the same time slowly apply a vertical pressure of 220MPa to it, keep the pressure for 20min, cool it down to room temperature naturally, and then demould to get a typical "sandwich" structure. Layer polymer matrix composite material, the scanning electron micrograph of the "sandwich" structure of the multilayer polymer matrix composite material is as follows Figure 5 shown by Figure 5 It can be seen that the prepared composite membrane has an obvious "sandwich" structure. From the cross-s...

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Abstract

The invention provides a polymer matrix composite which comprises a polymer matrix and nano-scale metal fillers, wherein the nano-scale metal fillers comprise nano-scale metal fibers and nano-scale metal grains; the nano-scale metal fibers and the nano-scale metal grains are under stable state through surface modified treatment; the nano-scale metal fillers are scattered in the polymer matrix; in the polymer matrix composite, the weight percent of the polymer matrix is 85-97% and the weight percent of the nano-scale metal fillers is 3-15%; the sum of the weight percent of the polymer matrix and the nano-scale metal fillers is 100%; in the nano-scale metal fillers, the mass ratio of nano-scale metal fibers to nano-scale metal grains is (1-3):1. The polymer matrix composite provided by the invention can effectively promote the heat conduction property of the composite, can achieve the purpose of maintaining low dielectric loss characteristic and can greatly increase the thermal and electric properties of the polymer matrix composite.

Description

technical field [0001] The invention relates to the technical field of electronic composite materials, in particular to a method of adding surface-modified nano-scale metal fibers and nano-scale metal particles into a polymer matrix in a certain mass ratio to prepare a single layer with a "point-line" structure. Composite materials, and on this basis, the "sandwich" structure multilayer polymer matrix composites are prepared. Background technique [0002] With the rapid development of microelectronics integration technology and high-density assembly technology of printed boards, the integration of electronic devices is increasing day by day. While achieving the goal of multi-function and high speed, the heat generated by electronic components is also increasing rapidly. According to statistics, 55% of the failures of electronic products are caused by poor heat dissipation. Therefore, under normal use conditions, how to make electronic components work reliably and stably has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L29/04C08L27/16C08L23/06C08L23/12C08L33/12C08L79/08C08L63/00C08K9/10C08K7/06C08K3/08B32B37/06B32B37/10
CPCC08K9/10B32B37/06B32B37/10B32B2309/02B32B2309/12C08J5/18C08J2329/04C08K3/08C08K7/06C08K2003/0806C08K2201/003C08K2201/011C08K2201/016C08L23/06C08L23/12C08L27/16C08L29/04C08L33/12C08L63/00C08L79/08C08L2203/16C08K2003/0812C08K2003/0856C08K2003/085C08K2003/0843C08K2003/0887
Inventor 刘峰周永存罗正平庄晓
Owner NORTHWESTERN POLYTECHNICAL UNIV
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