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Preparation method for using epoxy resin for microwave to package sheet mica capacitor

A technology of epoxy resin and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor electrodes, fixed capacitor parts, etc., can solve the problems of high material cost, high energy consumption, complicated process, etc., and achieve low material price and simplified process , The effect of less time-consuming process

Inactive Publication Date: 2009-12-23
蒋永昭
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of high material cost, high energy consumption and complicated process in the encapsulation and preparation of terminal electrodes of existing chip mica capacitors, and to provide a low-cost, energy-saving and environmentally friendly method for preparing chip mica capacitors

Method used

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  • Preparation method for using epoxy resin for microwave to package sheet mica capacitor

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Embodiment Construction

[0022] The invention will be further described below in conjunction with specific embodiments and accompanying drawings.

[0023] The preparation method of the chip mica capacitor for microwave is as follows:

[0024] Silver printed glass → assembly → sintering (430°C) → cut into strips → epoxy resin on the side → curing (150°C × 10 minutes) → cut into blocks → resin terminal electrodes → curing (180°C × 10 minutes) →Electroplating

[0025] The specific steps are:

[0026] a. On one side of a large mica sheet, print a silver paste layer on several squares designed according to the size of the product. After drying, print a silver paste layer with the same pattern on the second side after dislocation in one direction. After drying, it is sintered in a high-temperature furnace to prepare silver inner electrodes.

[0027] b. Print low-temperature glass paste on the silver-free side of the double-sided silver sheet, and assemble it in dislocation after drying. The surface is ma...

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Abstract

The invention discloses a preparation method for using epoxy resin for microwave to package a sheet mica capacitor and relates to a preparation method of the sheet mica capacitor, which aims at solving the defects that the package of the existing sheet mica capacitor and the preparation of the terminal electrode have high material cost, large energy consumption and complex technique; the preparation method comprises the following steps of: a. printing a silver paste layer at the two surfaces of the large mica in a staggered manner and sintering the silver paste layer into a silver inner electrode; b. printing glass paste at the no-silver of one surface of the mica with the two silver-plated surfaces, assembling in a staggered and laminating mode after being dried, assembling acid-resistant glass as protecting pieces on the two surfaces of the outer side, and sintering the glass protecting pieces and multilayer mica pieces into a whole; c. cutting the no-silver part of the large mica piece into a plurality of small strips, and respectively printing epoxy resin layers at the cutting parts of the small strips and curing; and d. cutting the small strips into blocks and leading the glue layer to be conductive at the exposed silver inner electrode and curing.

Description

technical field [0001] The invention relates to a preparation method of a chip mica capacitor, in particular to a preparation method of a chip mica capacitor encapsulated with epoxy resin for microwaves. Background technique [0002] Capacitors are widely used electronic components, and mica capacitors are one of them. The general mica capacitor uses metal foil or silver on the mica sheet as the internal electrode, and the silver sheet is stacked with a piece of copper foil or tin foil to lead out the internal electrode, and then the assembled is fixed with a copper clip, and the lead wire is welded. Die cast in bakelite powder or potted in epoxy resin. Its characteristics are: small dielectric loss, high insulation resistance, small temperature coefficient, suitable for high frequency circuits. However, it is bulky and has leads, so it is not suitable for surface mount components. [0003] The existing chip-type mica capacitors are bonded with glass and covered with silv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/08H01G4/005H01G4/224H01G4/232
Inventor 蒋永昭
Owner 蒋永昭