Manufacturing method of ultra-soft state photovoltaic welding belt

Abstract

The invention discloses a manufacturing method of an ultra-soft state photovoltaic welding belt. The method comprises the following steps: oxygen-free copper wires are firstly planished and are annealed in a continuous pipe mode; clear water is then used for carrying out ultrasonic cleaning on the annealed oxygen-free copper wires; copper belts are then soaked by a welding flux and are led to a tin furnace for plating tin, and an automatic speed-regulating draught fan is finally arranged at an outlet of the tin furnace; after coming out from the tin furnace, the copper belts plated with tin firstly pass through the draught fan, and then pass through an automatic capstan and an automatic wire-rewinding machine for hanging, and a finished product of the welding belt is formed. The invention adopts a continuous working procedure so that material loss is reduced, labor capacity is increased, and meanwhile, strong weldability and high conductivity of the welding belt are ensured. Compared with a conventional photovoltaic welding belt manufactured by a traditional method, the tensile stretch is increased by 40%, and the fragmentation rate in the process of welding is greatly reduced.

Description

technical field [0001] The invention relates to a method for manufacturing a welding ribbon, in particular to a method for manufacturing an ultra-soft photovoltaic welding ribbon. Background technique [0002] Ribbon is one of the main auxiliary materials of photovoltaic modules. It plays the role of connecting silicon wafers and conducting electricity on solar panels. Its inherent conductivity, solderability and elongation play a vital role in the quality of photovoltaic modules. . [0003] With the continuous development of photovoltaic technology, the parameters of silicon wafers have been greatly improved compared with before, especially in order to increase the power of silicon wafers per unit area. At present, the thickness of silicon wafers is getting thinner and thinner. It is also getting higher and higher, but the general solderability and elongation of conventional ribbons are difficult to meet the needs of the rapid development of photovoltaic modules, especiall...

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Problems solved by technology

[0003] With the continuous development of photovoltaic technology, the parameters of silicon wafers have been greatly improved compared with before, especially in order to increase the power of silicon wafers per unit area. At present, the thickness of silicon wafers is getting thinner and thinner. It is also getting higher and higher, but the general solderability and elongation of conventional ribbons are difficult to meet the needs of the rapid development of photovoltaic modules, especially when used for welding ultra-thin silicon wafers, the fragmentation rate is too high Phenomenon, bring greater economic losses to photovoltaic module manufacturers

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