Silver-copper nano alloy and preparation method thereof

A nano-alloy and alloy technology, applied in the field of silver-copper nano-alloy and its preparation, can solve the problems of inability to form an alloy and the like

Inactive Publication Date: 2010-02-10
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation methods of silver-copper nano-alloys mainly include: ion implantation method, gel sol method, particle beam mixing, ball milling and other methods. The main disadvantage of these preparation methods is that silver and copper cannot form alloys, but in the form of two-phase separation exists, the prepared material has two absorption peaks related to Ag and Cu

Method used

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  • Silver-copper nano alloy and preparation method thereof
  • Silver-copper nano alloy and preparation method thereof
  • Silver-copper nano alloy and preparation method thereof

Examples

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Embodiment 1

[0027] This embodiment is a silver-copper nano-alloy and its preparation method, wherein the molar composition of the silver-copper nano-alloy is (1-x)Ag-xCu, x=0.2 in this embodiment, the alloy composition is 0.8Ag-0.2Cu, The phase of the alloy is a single-phase solid solution with FCC structure; the microstructure of the alloy is dendrite, and the length of the primary dendrite of the selected alloy is 10-20 μm, the distance between the secondary dendrites is 100-200 nm, the length is 2-10 μm, and the third dendrite The crystal spacing is 10-20nm, and the length is 2-10nm. The preparation process of this embodiment comprises the following steps:

[0028] Step 1 Clean the ITO glass substrate

[0029] Soak the ITO glass substrate in 0.5mol / L NaOH solution for 15 minutes to increase the hydrophilicity of the ITO glass substrate; then rinse the ITO glass with deionized water; finally, ultrasonically clean the ITO in acetone solution for 15 minutes, to remove organic matter fro...

Embodiment 2

[0042] This embodiment is a silver-copper nano-alloy and its preparation method, wherein the molar composition of the silver-copper nano-alloy is (1-x)Ag-xCu, in this embodiment x=0.5, and the alloy composition is 0.5Ag-0.5Cu; The phase of the alloy is a single-phase solid solution with FCC structure; the microstructure of the alloy is dendrite, and the length of the primary dendrite of the selected alloy is 10-20 μm, the distance between the secondary dendrites is 100-200 nm, the length is 2-10 μm, and the third dendrite The crystal spacing is 10-20nm, and the length is 2-10nm. In this example, three samples were prepared under different deposition voltages, and the specific preparation process is as follows:

[0043] Step 1 Clean the ITO glass substrate

[0044] Soak the ITO glass substrate in 0.5mol / L NaOH solution for 15 minutes to increase the hydrophilicity of the ITO glass substrate; then rinse the ITO glass with deionized water; finally, ultrasonically clean the ITO i...

Embodiment 3

[0057] This embodiment is a silver-copper nano-alloy and its preparation method, wherein the molar composition of the silver-copper nano-alloy is (1-x)Ag-xCu, x=0.8 in this embodiment, and the alloy composition is 0.2Ag-0.8Cu; The phase of the alloy is a single-phase solid solution with FCC structure; the microstructure of the alloy is dendrite, and the length of the primary dendrite of the selected alloy is 10-20 μm, the distance between the secondary dendrites is 100-200 nm, the length is 2-10 μm, and the third dendrite The crystal spacing is 10-20nm, and the length is 2-10nm. In this example, three samples were prepared under different deposition voltages, and the specific preparation process is as follows:

[0058] Step 1 Clean the ITO glass substrate

[0059] Soak the ITO glass substrate in 0.5mol / L NaOH solution for 15 minutes to increase the hydrophilicity of the ITO glass substrate; then rinse the ITO glass with deionized water; finally, ultrasonically clean the ITO i...

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Abstract

The invention provides silver-copper nano alloy and a preparation method thereof. The silver-copper nano alloy comprises the mol component of (1-x) Ag-xCu, wherein x is equal to 0.2-0.8, and the phaseof the alloy is an FCC structure single-phase solid solution; the microstructure of the alloy is a dendritic crystal which is prepared by electrochemical deposition. In preparation, the single-phasesilver-copper nano alloy with an absorption peak is prepared by voltage and temperature control in an electrolyte formula and a constant electric potential deposition technology. Because of the technical scheme adopted by the invention, the size of nano particles is kept unchanged, the control of nano alloy components and the modulation of the resonant wavelength of plasma on the surface of the nano alloy are realized, and the transmission rule of electromagnetic energy in plasma crystals on the surface of metal is controlled under a condition that the periodicity of the plasma crystals can bekept unchanged.

Description

1. Technical field [0001] The invention belongs to the field of metal functional materials, in particular to a silver-copper nano-alloy and a preparation method thereof. 2. Background technology [0002] Metal plasmonic crystal (plasmonic crystal) is a metal functional material device with surface plasmon resonance (surface plasmonresonance, SPR) activity, which can control the electromagnetic field at the nanoscale, and has important applications in the defense industry and information industry, among which solar energy Devices such as batteries and high-density memory have begun to be commercially developed, with great commercial prospects and huge social benefits. [0003] At present, the preparation of metal plasmonic crystal devices mainly uses pure metal particles such as Ag, Au and Cu as raw materials, and the resonance wavelength of these materials is mainly modulated by factors such as size and shape. Taking pure metal nano-silver and nano-gold as examples, the fol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C5/08C22C30/02C25D3/56C25D3/58C25D3/64C25D5/00
Inventor 陈福义阎晓红
Owner NORTHWESTERN POLYTECHNICAL UNIV
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