High-temperature-resistant high-frequency conformal coating

A high-temperature and high-frequency technology, applied in the field of high-temperature and high-frequency three-proof coatings, can solve the problems of high-temperature resistance that cannot meet the requirements, harm to humans and the environment, and coatings that cannot meet high-temperature, high-frequency use and three-proof requirements at the same time

Inactive Publication Date: 2010-02-24
哈尔滨化工研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-frequency protective coating developed by Harbin Chemical Research Institute has several varieties of resistance to 60MHZ, 80MHZ, and 100MHZ, but they can only be used under conditions below 150°C, and the high-temperature resistance performance is far from meeting

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0012] The film-forming organosilicon modified epoxy resin is prepared by reacting organosiloxane with epoxy resin. The used silicone resin intermediate containing MeO group is composed of 1 mol MeSiCl 2 , 1mol PhSiCl 3 , 1molPh 2 SiCl 2 , 1.3mol H 2 O and 4.4mol MeOH reaction derived. Take out 300g of silicone modified epoxy resin, add 700g of bisphenol A epoxy resin and 400g of solvent, first heat at 70°C, then add 1g of aluminum triacetylacetonate, and react at 115°C for 2 hours, add 600g after cooling solvent to obtain a silicone-modified epoxy resin solution with a viscosity (25° C.) of 250 mPa·s and a solid content of about 50.0%.

[0013] Take 100g of the above-mentioned organosilicon modified epoxy resin solution and 10g of Kishi toughening agent and mix them evenly at room temperature to make A component; take 50g of low molecular polyamide curing agent, 2g of curing accelerator DMP-30, 2g of m-phenylene Diamine curing accelerator and 50g diluent are mixed unifo...

specific Embodiment approach 2

[0014] Silicone-modified epoxy resin as a film-forming material is prepared by reacting siloxane with epoxy resin. The used silicone resin intermediate containing MeO group is composed of 1 mol MeSiCl 2 , 1mol PhSiCl 3 , 1mol Ph 2 SiCl 2 , 1.3molH 2 O and 4.4mol MeOH reaction derived. Take out 300g, add 700g of bisphenol A epoxy resin and 400g of solvent, first heat at 70°C, then add 1g of aluminum triacetylacetonate, and react at 115°C for 2h, add 600g of solvent after cooling to obtain a viscosity (25°C) ) is a silicone-modified epoxy resin solution with a solid content of 250 mPa·s and a solid content of about 50.0%.

[0015] Take 100g of the above-mentioned silicone modified epoxy resin solution and 15g of Kishi toughening agent and mix them evenly at room temperature to make A component; take 40g of low molecular polyamide curing agent, 1g of curing accelerator DMP-30, 1g of m-phenylene Diamine curing accelerator and 100g diluent are mixed uniformly at room temperat...

specific Embodiment approach 3

[0016] Silicone-modified epoxy resin as a film-forming material is prepared by reacting siloxane with epoxy resin. The used silicone resin intermediate containing MeO group is composed of 1 mol MeSiCl 2 , 1mol PhSiCl 3 , 1mol Ph 2 SiCl 2 , 1.3molH 2 O and 4.4mol MeOH reaction derived. Take out 300g, add 700g of bisphenol A epoxy resin and 400g of solvent, first heat at 70°C, then add 1g of aluminum triacetylacetonate, and react at 115°C for 2h, add 600g of solvent after cooling to obtain a viscosity (25°C) ) is a silicone-modified epoxy resin solution with a solid content of 250 mPa·s and a solid content of about 50.0%.

[0017] Take 100g of the above-mentioned silicone modified epoxy resin solution and 10g of Kishi toughening agent and mix them at room temperature to make A component; take 50g of low molecular polyamide curing agent, 1g of curing accelerator DMP-30, 1g of m-phenylene Diamine curing accelerator and 100g diluent are mixed uniformly at room temperature to ...

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Abstract

The invention provides a high-temperature-resistant high-frequency conformal coating. The conformal coating comprises component A and component B with the weight ratio of 1:1, wherein, the component Acomprises 30-35% of organic silicon modified epoxy resin, 10-15% of Qishi toughening agent and the balance of dilutent by weight ratio; the component B comprises 30-35% of low molecular polyamide, 1.0-5.0% of DMP-30, 2.0-5.0% of m-phenylene diamine and the balance of dilutent by weight ratio. The conformal coating can solve the problems that the prior coating can not simultaneously meet the requirements of high-temperature, high-frequency use and conformal property, particularly, an electronic circuit board generates loss and damages under the states of high salt atmosphere, high damp-heat, high frequency and the like after being used for a period of time, thereby resulting in tremendous impacts on the whole electronic system.

Description

(1) Technical field [0001] The invention relates to a coating, more particularly to a high temperature resistant and high frequency three-proof coating. (2) Background technology [0002] At present, silicone coatings are mostly reported on high insulating coatings at home and abroad. For example, the DC-2103 and MS-804 silicone paints developed by Russia, the United Kingdom and the United States have a breakdown strength of about 205 to 604KV / mm. The Dow Corning Company of the United States has developed a silicone modified coating with good dielectric properties. Electrical properties, can be used in pulse transponder conductor dense printed circuit boards, as protective coatings for circuit boards and thick film circuits. Such are the WBD-6 silicone paint from Shanghai Resin Factory and SP silicone paint from Xi'an Insulation Material Factory. The "three-proof" protective coating developed and produced by Harbin Institute of Chemical Industry can reach the international...

Claims

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Application Information

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IPC IPC(8): C09D163/02C09D5/18C09D5/00
Inventor 苏桂明刘华荣王宇非姜卫丽郭示欣刘刚
Owner 哈尔滨化工研究所
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