Clad copper foil printed circuit board laminating plate of radiator

A technology for printed circuit boards and heat sinks, applied to printed circuit parts, circuits, electrical components, etc., can solve problems such as poor heat dissipation, low heat transfer efficiency, and large thermal resistance of the insulating layer, achieving poor heat dissipation, Large thermal resistance and low heat transfer efficiency
CN101657066AInactive Publication Date: 2010-02-24常州市超顺电子技术有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
常州市超顺电子技术有限公司
Publication Date
2010-02-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a clad copper foil printed circuit board laminating plate of a radiator, comprising a copper foil printed circuit board (1) and a radiator (2). The radiator (2) is used as a base body and (2) is integrally overlapped and bonded with the copper foil printed circuit board (1) into a whole through an insulating heat conducting layer (3); and an insulating solder-resist material layer (4) is arranged on the whole surface of the copper foil printed circuit board (1) located outside a pad (1-4). The invention has the characteristics of reasonable structure, favorable radiating effect, safe and reliable use, and the like.
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Description

technical field

[0001] The invention relates to a radiator-based copper-clad printed circuit board laminate, in particular to a circuit board laminate with a radiator mainly used for high-power light-emitting diode integrated light-emitting lamps. It belongs to circuit board technology. Background technique

[0002] With the in-depth development of energy-saving and consumption-reducing technologies, people have mastered the technology of using light-emitting diodes to integrate light emitters and lighting lamps, and have begun to achieve commercial success.

[0003] The key technology for the integration of several light-emitting diodes to produce light emitters and lighting lamps lies in the heat dissipation effect of their circuit boards (substrates). For this reason, existing radiator (body) and circuit board (layer) are come out by the technology of compounding insulating board (layer). The most common is to make aluminum-based copper-clad laminates into printed circu...

Claims

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