Crystal oscillator piece and method for manufacturing the same

Abstract

A crystal oscillator piece in which generation of leakage oscillation is suppressed, and its manufacturing method. The method for manufacturing a crystal oscillator piece comprises a step for forming a first etching mask on the surface of a crystal wafer and forming a second etching mask on the backside thereof, dipping the crystal wafer in etching solution, and dissolving the crystal at a part not covered with the first etching mask and the second etching mask to form an oscillation leg, and characterized in that the length of a first projection projecting from a position corresponding to the first end of the first etching mask is set, in the second etching mask, such that the first residue formed on the first side face side becomes constant regardless of positional shift of the first and second etching masks, and the first and second etching masks regulate the second residue formed on the second side face side such that one of two main axes passing the centroid and intersecting a cross-section orthogonal to the longitudinal direction of the oscillation leg dynamically and perpendicularly is formed substantially in parallel with the surface or the backside of the crystal wafer.

Description

technical field [0001] The present invention relates to a crystal resonator piece and a manufacturing method thereof, and more particularly to a crystal resonator piece having a structure that suppresses occurrence of leakage vibration (leak vibration) as out-of-plane vibration, and a method of manufacturing the same. Background technique [0002] The sound hairpin type crystal vibrator used for the vibrating compass passes through the process of cutting the crystal plate (ウエハ) into the desired shape of the crystal vibrator piece, the process of forming the electrode for vibrating the crystal vibrator piece, and the process of forming the electrode with the crystal vibrator piece. The process of installing the crystal vibrator piece in the container is carried out. In particular, since the shape of the crystal resonator piece greatly affects the performance of the device that determines the vibration, the process of cutting the crystal wafer into the crystal resonator piece ...

AI Technical Summary

Problems solved by technology

[0021] When such residues exist, as shown in Fig. 12(b), the drive vibration that should vibrate only in the X-axis direction is disturbed by the appearance of the residues, and as shown in Fig. 12(c). The components in the direction of the Z' axis vibrate obliquely, resulting in leakage vibration

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