A cleaning
machine table comprises a cleaning
pool, a cleaning device and a control device, the
manipulator is suitable for grabbing the
wafer and transmitting the
wafer; a transmitting end of the
laser detection module is located on one side of the cleaning
pool, a receiving end of the
laser detection module is located on the other side of the cleaning
pool, and a light path between the transmitting end and the receiving end corresponds to the position of the
wafer grabbed by the
manipulator; the first baffle is located on one side of the receiving end away from the transmitting end; and the first anti-reflection layer is arranged between the first baffle and the receiving end, and the first anti-reflection layer is suitable for inhibiting
mirror reflection of the
laser. The first anti-reflection layer is arranged, so that laser subjected to scattering and
diffuse reflection on the surface of the wafer is prevented from entering the surface of the first baffle and being reflected to the receiving end through the mirror surface of the first baffle, reflected light received by the receiving end is reduced, and the situation that the light received by the receiving end is too complex is avoided. Therefore, the receiving end can judge the position of the wafer according to the received laser from the transmitting end, so that
machine shutdown caused by wrong feedback of the
laser detection module to a
machine is avoided.