High-power transistor

Abstract

The invention discloses a high-power transistor, which comprises a wafer, a lead frame, leads, pins and a plastic sealing body, wherein the upper part of the lead frame automatically generates a radiating fin, while the lower part of the lead frame automatically generates a collector pin; both sides of the collector pin are provided with an emitter pin and a base pin at intervals; the lead frame is thin with the thickness of between 0.38 and 0.42 mm; and the pins are short with the length of between 6 and 7 mm, and are made of KFC copper materials containing iron of 2 to 5 percent. The high-power transistor has the characteristics of small size, raw material saving, low cost, high power, simple processing, reliable work and long service life, and can be widely used as a key electrical element in televisions, audio equipment, electronic instruments and equipment and electronic light source.

Description

technical field [0001] The invention relates to a semiconductor element, in particular to a high-power transistor. Background technique [0002] Transistor is an important electrical component, which is widely used in various household appliances such as televisions and audio equipment, electronic equipment, electronic light sources and other fields. At present, the core component lead frame of the semiconductor device transistor is made of KFC, which is a copper material containing 2-5% iron, which has excellent electrical and thermal conductivity, and has good thermal stress coordination with the chip. However, the price of KFC is expensive. Taking TO-126 packaging products as an example, the thickness of the lead frame is 5mm, so the product cost is high. In the actual use process, it is limited by the shape of the package, and the heat dissipation requirements are not high. In a few high-power In the application, the heat dissipation can be achieved by adding a heat sin...

AI Technical Summary

Problems solved by technology

However, the price of KFC is expensive. Taking TO-126 packaging products as an example, the thickness of the lead frame is 5mm, so the product cost is high. In the actual use process, it is limited by the shape of the package, and the heat dissipation requirements are not high. In a few high-power In the application, the heat dissipation can be achieved by adding a heat sink, so the thickness requirement for the lead frame is relatively low. If it is too thick, raw materials will be wasted and the cost will be increased. In addition, the length of the commonly used frame pins reaches 15-16mm, which is both Waste of material, and because the product is basically inserted directly into the deepest part of the printed circuit board PCB, the excessively long frame pins are cut off after welding as waste products, which not only increases the processing steps, but also the redundant pins are in the process of packaging and transportation. Easy to deform, causing inconvenience for subsequent tooling

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