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Manufacturing method of optical waveguide device

A technology of optical waveguide and manufacturing method, which is applied in the field of manufacturing optical waveguide devices, can solve problems such as unevenness, achieve the effect that the thickness will not become thicker, and the roughness of the surface can be suppressed

Inactive Publication Date: 2010-03-17
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The exposure from obliquely below is not uniform because it is done by diffuse reflection

Method used

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  • Manufacturing method of optical waveguide device
  • Manufacturing method of optical waveguide device
  • Manufacturing method of optical waveguide device

Examples

Experimental program
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Effect test

Embodiment 1

[0032] Substrate

[0033] A substrate made of PMMA [manufactured by Mitsubishi Rayon Corporation, thickness 2000 μm, arithmetic average roughness (Ra) 1.5 μm] was prepared.

[0034] Materials for forming the under cladding layer and the over cladding layer

[0035] Bisphenoxyethanol fluorenyl glycidyl ether (component A) represented by the following general formula (1): 35 parts by weight, alicyclic epoxy resin, namely 3', 4'-epoxycyclohexylmethyl 3 , 4-epoxyhexene carboxylate (manufactured by Daicel Chemical Industries, Ltd., CELLOXIDE 2021P) (component B): 40 parts by weight, (3',4'-epoxycyclohexane)methyl 3',4'- Epoxy cyclohexyl carboxylate (manufactured by Daicel Chemical Industries, Ltd., CELLOXIDE 2081) (component C): 25 parts by weight, and 4,4'-bis[bis(β-hydroxyethoxy)phenylsulfite]phenyl Sulfuric acid-bis-hexafluoroantimonate 50% propylene carbonate solution (component D): 2 parts by weight were mixed to prepare materials for forming the under cladding layer and...

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Abstract

A manufacturing method of an optical waveguide device which is capable of suppressing the surface roughening of core side surfaces of an optical waveguide when the optical waveguide is formed on a roughened surface of a substrate. An under cladding layer is formed on a roughened surface of a substrate made of a material that absorbs irradiation light, and then a photosensitive resin layer for theformation of cores is formed thereon. Irradiation light is directed toward this photosensitive resin layer to expose the photosensitive resin layer in a predetermined pattern to the irradiation lightthrough the mask. When the irradiation light transmitted through the photosensitive resin layer for the formation of the cores and the under cladding layer reaches the surface of the substrate, the irradiation light is absorbed by the substrate, so that there is little irradiation light reflected from the surface of the substrate. Therefor, the diffuse reflection on the surface of the substrate 1and the irradiation light that reaches the photosensitive resin layer are reduced, thereby suppressing the surface roughening of core side surfaces.

Description

technical field [0001] The present invention relates to a manufacturing method of an optical waveguide device widely used in optical communication, optical information processing, and other general optics. Background technique [0002] An optical waveguide of an optical waveguide device is usually formed by forming a core serving as an optical path in a predetermined pattern on the front surface of an under cladding layer, and forming an over cladding layer to cover the core. Such an optical waveguide is usually formed on the front surface of a substrate such as a metal substrate, and is manufactured together with the substrate as an optical waveguide. [0003] A conventional manufacturing method for manufacturing such an optical waveguide is as follows: First, as image 3 As shown in (a), the under cladding layer 2 is formed on the front surface of the substrate 10 . Next, if image 3 As shown in (b), a photosensitive resin for core formation is coated on the front surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/138
CPCG02B6/1221G02B6/138G02B6/132
Inventor 藤泽润一清水裕介
Owner NITTO DENKO CORP
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