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Temperature-uniforming plate with skiving fin structure and manufacture method thereof

A manufacturing method and technology of a vapor chamber, which are applied in cooling/ventilation/heating renovation, heat exchange equipment, lighting and heating equipment, etc., can solve the problem of reducing the heat transfer capacity of the vapor chamber A1, unable to withstand the internal water vapor pressure, and disadvantageous. Soldering and assembly of heat dissipation modules, etc., to achieve the effect of improving heat transfer capacity, increasing the mass flow rate of working fluid, and easy assembly

Active Publication Date: 2011-04-20
PEGATRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the excessively long circulation path and the small capillary structure permeability (permeability) will generate a large flow resistance, thereby reducing the heat transfer capacity of the chamber A1
Furthermore, the mechanical strength of this vapor chamber A1 is relatively weak and cannot withstand the internal water vapor pressure (about 4.7atm) at a temperature of 150°C, so it is not conducive to the soldering assembly of the heat dissipation module

Method used

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  • Temperature-uniforming plate with skiving fin structure and manufacture method thereof
  • Temperature-uniforming plate with skiving fin structure and manufacture method thereof
  • Temperature-uniforming plate with skiving fin structure and manufacture method thereof

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Embodiment Construction

[0017] Please refer to FIG. 3 and FIG. 4 , which are the structure of the vapor chamber disclosed in the first embodiment of the present invention. The vapor chamber 1 includes a first body 10 , a second body 20 , and a working fluid 40 .

[0018] The first body 10 is approximately rectangular and is composed of a base 11 and a plurality of side plates 12. Each side plate 12 is bent and approximately perpendicular to the base 11, so that the first body 10 is in the shape of a cover. In addition, the first body 10 A heating zone 111 is provided at the center of the base 11, and a first capillary structure 14 can be laid on the surface of the base 11. Here, the first capillary structure 14 can be a powder sintered or mesh porous structure, but the present invention Not limited thereto, a porous structure of mixed powder sintering and mesh type may also be used.

[0019] The second body 20 is substantially rectangular, and is combined with the first body 10 to form a closed space...

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Abstract

The invention relates to a temperature-uniforming plate with a skiving fin structure, which comprises a first body, a second body and a working fluid, wherein the first body is provided with a first capillary structure and is combined with the second body, and a close space is formed between the first body and the second body; the second body is provided with an integrally molded plate piece and a plurality of skiving fins which are formed by the skiving processing, a slant angle is formed between the skiving fins and the plate piece, and the skiving fins are connected to the first body; the working fluid is positioned in the close space, and the vaporous working fluid reflows to the first body through the skiving fins by the plate piece after being condensed. The invention also disclosesa manufacture method of the temperature-uniforming plate with a skiving fin structure.

Description

technical field [0001] The invention relates to a uniform temperature plate structure, in particular to a uniform temperature plate with a shoveled fin structure. Background technique [0002] With the development and progress of information technology, the size of semiconductor power crystals (such as CPU, GPU, high-power LED) is getting smaller and smaller, the heat generated by power crystals is getting higher and higher, and the heat flux per unit area is getting bigger and bigger. Operate under the allowable temperature, and combine various forms of heat sinks on the electronic components to provide heat dissipation. Among them, the vapor chamber has the advantages of high thermal conductivity, high heat transfer capacity, simple structure, light weight, and no power consumption. It is very suitable for the heat dissipation requirements of electronic components, and its application will become more and more popular. [0003] As shown in Figures 1 and 2, it is known tha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02B23P15/26H05K7/20
CPCF28D15/0233F28F3/12F28F3/048F28D15/046
Inventor 刘睿凯锺兆才
Owner PEGATRON