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Method for packaging light emitting diode

A technology of light-emitting diodes and thermoplastic materials, applied in chemical instruments and methods, electrical components, circuits, etc., can solve the problems of easy yellowing, non-recyclability, and UV resistance.

Inactive Publication Date: 2010-03-31
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, epoxy resin has the disadvantages of being not resistant to ultraviolet rays (ultraviolet, referred to as UV), easy to yellow, poor durability, and cannot be recycled.

Method used

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  • Method for packaging light emitting diode
  • Method for packaging light emitting diode

Examples

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Embodiment 1

[0016] Acrylic esters such as methacrylate (MMA), hydrogen-bonding monomers such as methacrylamide (MAAM for short), macrosteric barrier monomers such as isobomyl methacrylate (isobomyl methacrylate, short for short) were used in different weight ratios. IBMA), and the first-stage thermal initiator benzoyl peroxide (benzoyl peroxide, I-BPO for short), react at 60° C. to 80° C. for 1-3 hours. When the viscosity of the above mixture increases, add the thermal initiator benzoyl peroxide (II-BPO for short) in the second stage and lower the temperature to 40°C to 60°C, and react for about 0.5-3 hours. Finally, the above mixture was placed in an oven and reacted at 90° C. for two hours and at 130° C. for two hours to complete the block polymerization reaction. After the reaction, properties such as Tg, transparency, and UV yellowing resistance of the copolymer were measured. The weight ratio of the above reactants and the physical properties of the formed copolymer are shown in Tab...

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Abstract

The invention provides a method for packaging a light emitting diode by a thermoplastic copolymer. The thermoplastic copolymer is prepared by copolymerization of 100 parts of acrylate by weight, 0.1-30 parts of hydrogen bond monomer by weight and 0.1-70 parts of large stereo hindrance monomer by weight. Because the transparence of the polymer is greater than 90%, the heat resisting temperature ofthe polymer is greater than 130 DEG C and the water absorptivity of the polymer is smaller than 0.5wt%, the polymer is suitable for a packaging material of a light emitting component.

Description

technical field [0001] The invention relates to a method for packaging light-emitting diodes, and more particularly relates to the composition of thermoplastic materials used in the method. Background technique [0002] At present, materials for packaging light-emitting diodes (LEDs for short) are mainly epoxy resin and silicone resin. Considering factors such as cost and electrical characteristics, epoxy resins are mainly used in automotive lighting and signal lights, while silicone resins are mainly used in high-power LCDs. However, epoxy resin is a thermosetting material and needs to be packaged in time-consuming methods such as infusion molding or transfer molding. In addition, the epoxy resin has the disadvantages of being not resistant to ultraviolet light (UV for short), easy to yellow, poor in durability, and unable to be recycled. Compared with this, polymethylmethacrylate (PMMA for short) is not only cheap, but also has excellent UV resistance and weather resista...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/56H01L23/29C09K3/10
Inventor 叶淑铃庄雅岚蔡佩容林志祥高信敬张丰志吴当荣
Owner IND TECH RES INST
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