High-power LED lamp effectively lowering packaging thermal resistance

Abstract

The technical problem provides a high-power LED lamp effectively lowering packaging thermal resistance, which has a novel structure, and lowers thermal mismatching stress without greatly increasing the heat sink thickness. The technical scheme is that: the high-power LED lamp effectively lowering the packaging thermal resistance comprises a metallic base, an LED chip packaged on the metallic base, a metallic conductor and a packaging colloid, wherein a heat sink buffer layer, used for buffering the thermal mismatching stress between the LED chip and the metallic base, is arranged between the metallic base and the LED chip; the heat sink buffer layer is an FeNi alloy layer electroplated on the metallic base, and the FeNi alloy layer is between 2 and 5 micrometers in thickness; the LED chip and the heat sink buffer layer are connected in a mode of eutectic welding; the Ni content in the FeNi alloy layer is 36 percent; and the metallic base 1 is made of copper materials with better heat-conducting property. The high-power LED lamp effectively lowering the packaging thermal resistance has a novel structure, and effectively lowers the thermal mismatching stress so as to ensure the efficacy and service life of the high-power LED lamp.

Description

technical field [0001] The invention relates to an LED illuminating device, in particular to a high-power LED lamp with effectively reduced packaging thermal resistance. Background technique [0002] For high-power LED devices, minimizing the number of heat sinks in the heat transfer circuit is an important way to reduce thermal resistance, that is, the chip is directly packaged on the metal heat sink. However, due to the mismatch of the thermal expansion coefficient between the LED chip and the metal material, thermal mismatch stress will be generated after the two are heated, which will lead to adverse consequences such as LED device luminous failure or weakened heat conduction effect. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a high-power LED lamp that effectively reduces the thermal resistance of the package, has a new structure, reduces thermal mismatch stress, and does not greatly increase the thickne...

AI Technical Summary

Problems solved by technology

However, due to the mismatch of the thermal expansion coefficient between the LED chip and the metal material, thermal mismatch stress will be generated after the two are heated, which will lead to adverse consequences such as LED device luminous failure or weakened heat conduction effect.

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