Improvement method for wrinkled copper foil in compacting process of high-rise plates

Abstract

The invention discloses an improved method of a wrinkled copper foil in the compacting process of high multi-layer boards, which can improve wrinkling in a copper-free area, and especially improve wrinkling of copper-free sites in a choked flow side and a pattern area. The invention uses the following basic technical scheme: residual copper of the choked flow sides at odd layers are removed and only functional targets are retained when core film data are manufactured; and when the choked flow sides at the board sides are removed from the single face of a board with the inner surface core board thickness equal to or more than 4mil, the board has larger flexibility, and over etching and brown oxide process are easy to cause board blocking. The method for retaining the residual copper at the chocked side corner at the odd layers and using junked thick core boards for adhering and cutting can be used to replace etching and brown oxidizing. The invention has the advantages of ensuring high production efficiency, controlling cost, improving wrinkling in the copper-free area especially wrinkling in the copper-free sites in chocked flow sides and pattern areas, and having stronger operability.

Description

technical field [0001] The invention belongs to the technique for improving wrinkling in a copper-free area of ​​a high-layer board belonging to the field of printed circuit boards. Specifically, the purpose of improving wrinkling in the copper-free area is achieved by optimizing the auxiliary production materials. Background technique [0002] With the rapid development of the electronics industry, printed circuit board technology is developing towards high precision and high multi-layer, and subsequently, higher quality requirements are put forward for the laminated board surface. In the production of high-layer boards in the industry, except for the sundries and pits caused by the sanitation of the production environment, the quality of the board surface is poor. The most common board quality problem is the wrinkling of the copper-free area. The original production process and improvement The process of wrinkling in the copper-free area can no longer meet the requirement...

AI Technical Summary

Problems solved by technology

[0006] Disadvantages: This method can significantly improve the wrinkling of the copper-free area in the actual production process, but it seriously increases the production cost and reduces the production efficiency

[0009] Disadvantages: In addition to the poor quality problems of wrinkling in the non-copper area, high-layer boards also have quality problems such as misalignment between lamination layers, slide plates, and thickness of dielectric layers. Not strong

[0012] Disadvantages: This method can effectively improve the wrinkling of the copper-free area, but for the fully symmetrical inner layer graphics in the copper-free area, the board cannot be symmetrically arranged, and the copper-free area with drilled holes and lines between the choke edge and the graphics, and the outer layer graphics Auxiliary residual copper cannot be added to the area, and the operability is not strong

[0013] From the above methods, it can be known that the original method of improving wrinkling in the copper-free area will not only reduce production efficiency and increase production costs, but also has poor operability

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