A control method for uniformly laminating a multi-layered PCB is disclosed. The control method comprises the steps of PCB laminating and pressing. The control method is simple, convenient, and easy to operate and master; the
layers are aligned accurately and the PCB is pressed uniformly; board sliding and decompression can be avoided, and high product quality can be achieved; the lamination process is easy to control, and easy
machining and low cost are realized as well; the relatively consistent uniformity of the thickness of each laminated board among different
layers can be accurately ensured; sufficient and uniform flowing
adhesive in all directions is supplied; the thickness and the impedance of a laminated
dielectric layer are moderate; the board edge is designed in a choked-flow manner; the overall uniformity of the laminated PCB is high; the fused flowing time of resin in a prepreg is prolonged, so that sufficient stuffing among the multiple core plate
layers is ensured, uniform fused resin flowing is realized, and the efficiency is greatly improved; and in addition, the service life of equipment is prolonged, the lamination quality is effectively ensured, and the production cost is lowered.