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Negative photosensitive material and circuit board

A circuit substrate, photosensitive technology, applied in the direction of circuit substrate materials, photosensitive materials for optomechanical equipment, printed circuit components, etc.

Inactive Publication Date: 2010-07-21
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the polyimide layer used as an insulating layer or a protective layer needs to have a thickness of several microns or more

Method used

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  • Negative photosensitive material and circuit board
  • Negative photosensitive material and circuit board
  • Negative photosensitive material and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0153] 5.88 g (0.0200 mol) of BPDA as an acid dianhydride, 3.43 g (0.0162 mol) of o-DDBP and 0.84 g (0.0029 mol) of APB as a diamine were dissolved in 53.29 g of DMAc. The molar ratio of acid dianhydride to diamine was 1.05. The polyamic acid solution of the polyimide precursor was obtained by stirring this solution for 12 hours. 10 wt% of photobase generator (C) was added with respect to the polyamic acid in the said polyamic-acid solution, and the negative photosensitive material solution was prepared.

[0154] Next, the above-mentioned solution was dropped onto a stainless steel foil having a thickness of 18 μm, a film was formed by spin coating, and pre-drying was performed at 80° C. for 5 minutes under a nitrogen atmosphere. The film thickness of the negative photosensitive material after pre-drying was 17 μm. Afterwards, with an ultra-high pressure mercury lamp, the negative photosensitive material film after the above-mentioned pre-drying is irradiated with 2000mJ / cm ...

Embodiment 2

[0171] 5.88 g (0.0200 mol) of BPDA which is an acid dianhydride, and 3.87 g (0.0182 mol) of o-DDBP which are diamines were dissolved in 39.01 g of DMAc. The molar ratio of acid dianhydride to diamine was 1.096. By stirring this solution for 12 hours, a polyamic acid solution was obtained. The photobase generator (C) was added so that it might be 30 wt% with respect to the polyamic acid in the said polyamic-acid solution, and the negative photosensitive material solution was prepared.

[0172] Next, as in Example 1, the above solution was dropped onto a 20 μm thick stainless steel foil to form a film by spin coating, and pre-dried at 100° C. for 5 minutes in a nitrogen atmosphere. Afterwards, irradiate 1000mJ / cm2 to the above-mentioned negative photosensitive material film after pre-drying through a photomask with an ultra-high pressure mercury lamp. 2 of active light. Furthermore, after post-curing by heating at 170 degreeC for 7 minutes in nitrogen atmosphere, it developed...

Embodiment 3

[0175] 5.88 g (0.0200 mol) of BPDA and 2.14 g (0.0066 mol) of BTDA which are acid dianhydrides, and 4.58 g (0.0216 mol) and 0.7622 g (0.0038 mol) of o-DDBP which are diamines were dissolved in 53.48 g of DMAc. The molar ratio of acid dianhydride to diamine was 1.050. By stirring this solution for 12 hours, a polyamic acid solution as a polyimide precursor was obtained. The photobase generator (C) was added so that it might be 30 wt% with respect to the polyamic acid in the said polyamic-acid solution, and the negative photosensitive material solution was prepared.

[0176] Next, as in Example 2, the above solution was dropped onto a 20 μm thick stainless steel foil to form a film by spin coating, and pre-dried at 100° C. for 5 minutes in a nitrogen atmosphere. Afterwards, irradiate 2500mJ / cm2 to the negative-type photosensitive material film after the above-mentioned pre-drying with ultra-high pressure mercury lamp through photomask 2of active light. Furthermore, after post...

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Abstract

Disclosed is a negative photosensitive material having excellent sensitivity, which has a linear thermal expansion coefficient equivalent to that of a metal foil constituting the substrate and is developable with an aqueous alkali solution. Also disclosed is a low-cost circuit board using such a negative photosensitive material. Specifically disclosed is a negative photosensitive material containing 5-30 parts by weight of a quaternary ammonium salt per 100 parts by weight of a polyimide precursor having a repeating unit represented by the general formula (I) below. The quaternary ammonium salt is a photobase generator which generates a tertiary amine when irradiated with an active ray, and the tertiary amine contains one or more nitrogen atoms and one or more oxygen atoms in a molecule. In the formula (I) below, X represents a tetravalent aliphatic group or a tetravalent aromatic group, and Y represents a divalent aliphatic group or a divalent aromatic group.

Description

technical field [0001] The present invention relates to a photosensitive material and a circuit substrate made using it. Background technique [0002] For the purpose of high-density mounting or high-speed signal processing, thin-film multilayer substrates are attracting attention, and circuit substrates in which polyimide resin with excellent heat resistance is provided as an insulating layer on a metal foil are used. In addition, polyimide resin is similarly used as a protective layer for wiring on such a circuit board. In recent years, polyimide used as an insulating layer and / or a protective layer needs to be processed with high precision, as is the processing of the metal foil used as the wiring part, especially in the course of high density. Among them, in the application of suspension arms for hard disks, densification along with miniaturization and weight reduction is rapidly progressing. [0003] The processing of polyimide generally uses methods such as mechanica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004C08G73/10G03F7/038H05K1/03H05K3/28
Inventor 德弘淳关野裕幸千田光昭铃木健司
Owner MITSUI CHEM INC
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