Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for preparing micro-nano-silica film on red copper substrate

A silicon dioxide, micro-nano technology, applied in the direction of metal material coating process, etc., can solve the problems of long preparation process of deposition solution, weak combination of coating and substrate, loss of application meaning of coating, etc., to shorten the preparation time Time, good corrosion resistance, uniform and dense film effect

Inactive Publication Date: 2010-07-28
TIANJIN UNIV
View PDF7 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The above methods all have the disadvantage of incomplete substrate pretreatment
Such as Chinese patent 200710168732.1, which only uses lye and hydrochloric acid to treat the substrate, and the mineral oil on the surface of the substrate cannot be removed with lye, and an organic solvent must be used, otherwise it will easily cause the combination of the coating and the substrate to be weak, and the coating will also be damaged. Lost the significance of application; liquid deposition method is a selective film-forming method, which can only be deposited on the surface with hydroxyl groups, while Chinese patent 200710060653.9 does not take effective measures to enrich the metal surface with hydroxyl groups; Chinese patent 200610171664. X is based on non-metallic materials, such as silicon wafers, and is applied in the field of semiconductor technology, and the preparation process of the deposition solution in the early stage takes a long time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing micro-nano-silica film on red copper substrate
  • Method for preparing micro-nano-silica film on red copper substrate
  • Method for preparing micro-nano-silica film on red copper substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] (a) Substrate pretreatment and grinding: use 500# sandpaper to remove surface dirt and initial grooves on the substrate until the substrate surface is completely covered with 500# sandpaper texture; use 800# sandpaper to polish, and change the grinding direction by 90° until the substrate surface is 500# Grind with 1000# sandpaper until the traces of sandpaper disappear; then grind with 1000# sandpaper and change the grinding direction by 90° until the traces of 800# sandpaper on the substrate surface disappear; Grind with 1600# sandpaper and change the grinding direction by 90° until the surface of the substrate is 1000# sandpaper Finally, use 2000# sandpaper to polish, and change the grinding direction by 90° until the traces of 1600# sandpaper on the surface of the substrate disappear. At this time, the texture of the substrate is very fine and bright. Polishing: use the wool polishing wheel of C121 metal polishing machine to coat commercially available green polishin...

Embodiment 2

[0051] (a) Substrate pretreatment and grinding: use 500# sandpaper to remove surface dirt and initial grooves on the substrate until the substrate surface is completely covered with 500# sandpaper texture; use 800# sandpaper to polish, and change the grinding direction by 90° until the substrate surface is 500# Then use 1000# sandpaper to grind, and change the grinding direction by 90° until the grinding traces of 800# sandpaper on the surface of the substrate disappear; use 1500# sandpaper to polish, change the grinding direction by 90°, until the surface of the substrate is 1000# sandpaper Finally, use 2000# sandpaper to polish, and change the grinding direction by 90° until the grinding traces of 1500# sandpaper on the surface of the substrate disappear. At this time, the texture of the substrate is very fine and bright. Polishing: Coat the commercially available green polishing soap with the wool polishing wheel of the C121 metal polishing machine, and polish the surface of...

Embodiment 3

[0061](a) Substrate pretreatment and grinding: use 500# sandpaper to remove surface dirt and initial grooves on the substrate until the substrate surface is completely covered with 500# sandpaper texture; use 800# sandpaper to polish, and change the grinding direction by 90° until the substrate surface is 500# Then use 1000# sandpaper to grind, and change the grinding direction by 90° until the grinding traces of 800# sandpaper on the surface of the substrate disappear; use 1800# sandpaper to polish, change the grinding direction by 90°, until the surface of the substrate is 1000# sandpaper Finally, use 2000# sandpaper to polish, and change the grinding direction by 90° until the traces of 1800# sandpaper on the surface of the substrate disappear. At this time, the texture of the substrate is very fine and bright. Polishing: use the wool polishing wheel of C121 metal polishing machine to coat commercially available green polishing soap, and polish the surface of the copper subs...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for preparing a micro-nano-silica film on a red copper substrate, comprising the following steps of: (a) pre-treating the red copper substrate; (b) adding analytically pure silicic acid to analytically pure fluosilicic acid to prepare a homogeneous first solution, then putting the first solution in a water bath for magnetic stirring; (c) adding de-ionized water to the first solution to prepare a second solution, and then putting the second solution in the water bath for magnetic stirring; (d) weighing the analytically pure boric acid and adding the boric acid to the second solution to prepare a third solution, and then putting the third solution in the water bath for magnetic stirring; (e) putting the substrate in the third solution for depositing to prepare a base plate which is coated by a silica film; (f) taking out the base plate after the depositing, washing the surface of the base plate to remove the surface residues; (g) putting the base plate to an electrical resistance furnace for heating after drying the base plate; (h) closing the electrical resistance furnace, and obtaining the silica micro-nano film coating layer after natural cooling of the electrical resistance furnace. The invention has the advantages that the film prepared by the method provided by the invention is uniform and dense; and the combination of the coating layer and the substrate is more solid.

Description

technical field [0001] The invention belongs to a method for preparing a liquid-phase deposition of an anti-corrosion and anti-fouling coating on the surface of a metal material, and in particular relates to a micronano-level thickness SiO on a copper substrate 2 The preparation method of the liquid phase deposition method of the thin film. Background technique [0002] Corrosion and scaling problems in geothermal water utilization systems have always been serious obstacles to the development and utilization of geothermal energy, and are one of the most important research topics in the world today. According to statistics, the global economic loss caused by steel corrosion is about 700 billion U.S. dollars every year, accounting for 2%-4% of the gross national product of various countries; and the appearance and thickening of the scale layer will increase the fluid resistance and energy consumption on the one hand. , reduce the water output and affect the normal operation. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/34C23C22/77C23C22/78C23C22/82
Inventor 刘明言陈宁
Owner TIANJIN UNIV