Patch-type filamentous fuse and manufacturing method thereof

A fuse and chip technology, applied in the field of electronic protection components, can solve the problems of difficulty in producing small or ultra-small fuses, difficult to guarantee compactness, low production efficiency, etc., and achieve stable and reliable processing technology and production costs. The effect of low, production efficiency improvement

Inactive Publication Date: 2010-08-04
NANJING SART SCI & TECH DEV
View PDF6 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a fatal defect in this process, that is, after the printed circuit is sintered and dried, its compactness is difficult to guarantee, resulting in a large dispersion of product performance. In addition, environmental protection issues caused by electroplating are increasingly concerned
The performance of fuses manufactured by threading wires in the cavity is relatively stable, but its production efficiency is low, resulting in relatively high product costs, and it is difficult to produce small or ultra-small fuses

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Patch-type filamentous fuse and manufacturing method thereof
  • Patch-type filamentous fuse and manufacturing method thereof
  • Patch-type filamentous fuse and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0023] The preparation of the fuse of the present invention: form a plurality of small cell array substrates (such as figure 2 ), each substrate unit has an independent circuit board that is the same as other units, the circuit board is formed by evaporation, electroplating or etching, and then the fuse is bonded or welded on the surface electrode of the circuit board, The encapsulation material wraps the fuse wire, solder joint or bonding point and part of the surface electrode, and is tightly connected with the substrate, and then the whole substrate is cut to form this product.

[0024] The above-mentioned fuses may be one or more according to different products. Fuse diameters range from 15 microns to 500 microns.

[0025] During production, first clean the substrate 4, remove the dust and dirt on the surface of the substrate in an ultrasonic cleaning machine, place the substrate in a special fixture, and then use ultrasonic pressure welding or solder bonding to bond the...

Embodiment 1

[0028] like image 3 , Figure 4 As shown, a single fuse 6 is welded or bonded to the electrode area 5 of the substrate, and the encapsulation layer 7 wraps the fuse 6 and is closely attached to the substrate 4, ensuring the airtightness of the encapsulation.

Embodiment 2

[0030] like Figure 5 , Image 6 As shown, two fuses 6 are welded or bonded to the electrode area 5 of the substrate, and the encapsulation layer 7 wraps the fuses 6 and is closely attached to the substrate 4, ensuring the airtightness of the encapsulation.

[0031] The performance of the products produced by this process is compared with that of traditional products. The resistance of the products produced by this process is relatively stable. The maximum and minimum resistance values ​​of the same batch of products are within 5 milliohms, and the voltage drop can be controlled within 5%. , and its fusing characteristics are also very consistent, which fully demonstrates the feasibility and advancement of the process.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a patch-type filamentous fuse and a manufacturing method thereof. The invention has the technical scheme that one or a plurality of strips of fuse materials with the same or different specification are stuck or welded at the electrode position of a base board in a certain mode, and then are encapsulated by resin or other suitable insulation materials and cut to obtain the granular fuse. Because automatic fuse feeding and fuse cutting by the machine are adopted, the lengths of the fuse body are basically consistent, so the performance of the product is ensured. The invention has the advantages of greatly improving the consistency of the performance of the patch-type fuse, effectively reducing the production cost of the patch-type fuse, ensuring the quality of the product and improving the reliability of the product. The scheme also has the advantages of simple and practical technology and the like, and has better application and popularization value.

Description

technical field [0001] The invention belongs to the field of electronic protection components, and in particular relates to a patch type filamentary fuse and its manufacturing method. Background technique [0002] Chip fuses are widely used in printed circuit boards, and their size is getting smaller and smaller with the miniaturization of electronic devices. It is an electrical component installed in a circuit to ensure the safe operation of the circuit. When a fault or abnormality occurs in a circuit, the current will continue to rise, and the rising current may damage some important or valuable components in the circuit, and may also burn the circuit or even cause a fire. Fuses protect electronic equipment from overcurrent and can also prevent serious damage to electronic equipment due to internal faults. [0003] There are two methods widely used to manufacture fuses at present, one is printing and electroplating process, and the other is threading wire in cavity. The...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01H85/04H01H85/05H01H85/143H01H69/02
Inventor 王劲陆秀荣杨漫雪南式荣
Owner NANJING SART SCI & TECH DEV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap