Sn-58Bi lead-free solder reinforced by carbon nano tube and preparation method thereof

A sn-58bi, carbon nanotube technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of Sn-58Bi alloy plastic reduction, affecting the performance of welded joints, etc.

Inactive Publication Date: 2010-09-01
HARBIN INST OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that Bi itself is very brittle, which reduces the plasticity of Sn-58Bi alloy and affects the performance of welded joints, and provides a carbon nanotube reinforced Sn-58Bi lead-free solder and its preparation method

Method used

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  • Sn-58Bi lead-free solder reinforced by carbon nano tube and preparation method thereof
  • Sn-58Bi lead-free solder reinforced by carbon nano tube and preparation method thereof
  • Sn-58Bi lead-free solder reinforced by carbon nano tube and preparation method thereof

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specific Embodiment approach 1

[0010] Specific Embodiment 1: In this embodiment, carbon nanotube reinforced Sn-58Bi lead-free solder is ball milled with eutectic Sn-58Bi alloy powder and carbon nanotubes under the protection of argon, and then the mixture is smelted by adding flux and air-cooled Made, wherein the mass fraction of carbon nanotubes in the mixture of eutectic Sn-58Bi alloy powder and carbon nanotubes after ball milling is 0.01% to 0.1%, and the mixture of eutectic Sn-58Bi alloy powder and carbon nanotubes after ball milling and auxiliary The mass ratio of flux is 8:2. The mass fraction of Sn in the eutectic Sn-58Bi alloy powder is 42%, and the mass fraction of Bi is 58%.

[0011] The carbon nanotubes used in this embodiment are multi-walled carbon nanotubes.

[0012] The carbon nanotubes (FloTube9000) used in this embodiment are provided by Cnano Co., Ltd., and the ball mill used for ball milling is a QM-1SP planetary ball mill produced by Nanjing University Instrument Factory.

specific Embodiment approach 2

[0013] Embodiment 2: This embodiment differs from Embodiment 1 in that the particle size of the eutectic Sn-58Bi alloy powder is 25 μm˜75 μm. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0014] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that the flux is Flux55. Others are the same as those in the first or second embodiment.

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Abstract

The invention relates to an Sn-58Bi lead-free solder reinforced by a carbon nano tube and a preparation method thereof, in particular to a low-temperature solder and the preparation method thereof, which solves the problem that the plasticity of Sn-58Bi alloy is lowered owing to the frangibility of BI to affect the property of welding joints. TheSn-58Bi lead-free solder reinforced by the carbon nano tube is prepared from eutectic Sn-58Bi alloy powder, the carbon nano tube and soldering flux. The preparation method comprises the following steps: ball-milling the eutectic Sn-58Bi alloy powder and the carbon nano tube under the protection of argon to obtain solder powder; and uniformly mixing the solder powder with the soldering flux, and then smelting and air-cooling to obtain the reinforced Sn-58Bi lead-free solder. In the invention, the maximum bending strength of the Sn-58Bi lead-free solder reinforced by the carbon nano tube is 184.12MPa, improved by 10% than that of Sn-58Bi solder alloy; the elongation is improved by about 48.9% than that of the Sn-58Bi solder alloy; and compared with the original solder, the quantity of the welding spots with tensile strength distributed in 11-15N is improved by 52.2%.

Description

technical field [0001] The invention relates to a low-temperature lead-free solder and a preparation method thereof. Background technique [0002] The low-temperature solder represented by the Sn-58Bi alloy system has unique advantages in the application of low-temperature packaging. However, because Bi itself is very brittle, the Sn-58Bi alloy has high brittleness and low ductility. Bi is easy to crystallize in the alloy to form a coarse and irregular shape, especially when the long-term high-temperature operation is more serious, resulting in a decrease in the plasticity of the alloy, and even brittle failure, which seriously affects the performance of the welded joint. Therefore, it is urgent to reduce the brittleness of the alloy. solved problem. Contents of the invention [0003] The purpose of the present invention is to solve the problem that Bi itself is very brittle, which reduces the plasticity of Sn-58Bi alloy and affects the performance of welded joints, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/40
Inventor 何鹏马鑫安晶陈胜林铁松钱乙余
Owner HARBIN INST OF TECH
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