Through-hole type wafer-level package structure for vibrator device

Abstract

The invention relates to a through-hole type wafer-level package structure for a vibrator device, which comprises an upper cover, a vibrator unit, a base, a packaging ring and a metal through hole. The packaging ring is arranged between the base and the upper cover for the combination between the upper cover and the base; the vibrator unit is hermetically packaged on the base; and the metal through hole vertically runs through the base and is electrically connected with the vibrator unit so as to provide the signal output / output for the vibrator unit. Therefore, high-integration package can be achieved, the problem of thermal stress resulted from a sandwich package structure is solved, the consumption of noble metal materials is reduced, the dimension is further reduced, and parasitic capacitance or inductance effect derived from high frequency is reduced.

Description

technical field [0001] The present invention relates to the field of vibrator devices, in particular to a wafer-level packaging structure of through-hole vibrator devices used in various electronic products such as mobile phones, notebook computers, and automotive electronics. Background technique [0002] Quartz components have stable piezoelectric characteristics and can provide precise and wide reference frequency, frequency control, timing function and noise filtering functions. In addition, quartz components can also be used as motion and pressure sensors, as well as important optical components; therefore , for electronic products, quartz components play a pivotal role. [0003] For the packaging of quartz oscillator crystals, many solutions have been proposed before, such as the US Patent No. 5030875 patent "Sacrificial Quartz-crystal Mount", which belongs to the packaging of early metal caps. way, its overall packaging structure is complex and its volume cannot be r...

AI Technical Summary

Problems solved by technology

However, due to the different thermal expansion coefficients of the base material and quartz in this sandwich structure, thermal stress will be generated in the internal quartz chip when the temperature changes, causing the frequency to shift with temperature

Therefore, it is necessary to specially select the cutting angle of the quartz chip and the thermal expansion coefficient of the upper cover and the lower base material to overcome this difficulty. However, it is more labor-intensive in terms of production and cost.

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