Metal copper powder film coating equipment and coating method

A technology of thin film coating and copper powder, which is applied in the coating process and coating of metal materials, which can solve the problems of uneven coating, time-consuming and labor-intensive production, and cost of raw materials.

Inactive Publication Date: 2010-09-15
陈文进 +2
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the film thickness of the film is not easy to control by manual coating method, and it is easy to be unevenly coated, and the metal powder mixture is a wet coating method, followed by sintering, which is not only time-consuming and laborious , and relatively consume the cost of raw materials for production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Metal copper powder film coating equipment and coating method
  • Metal copper powder film coating equipment and coating method
  • Metal copper powder film coating equipment and coating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The above and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings.

[0012] figure 1 It is a schematic structural view of the metal copper powder film coating equipment of the present invention, as shown in the figure, a metal copper powder film coating equipment 10 is mainly used for the film coating operation of the metal base material 12 of the cooling plate, and the metal base material 12 is copper Material, the metal substrate 12 needs to go through the surface cleaning step before coating. The surface cleaning step uses pure water grade or ultrapure water grade to minimize the particles and impurities in the coating environment and keep the overall coating environment dry . Metal copper powder film coating equipment 10 of the present invention comprises a conveying device 14, can convey metal base material 12, and conveying device 14 is a conveyor belt; A coating dev...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses metal copper powder film coating equipment and a coating method. The metal copper powder film coating equipment comprises a transporter, a coating device and an earthing device, wherein the coating device can provide metal copper powder and causes the metal copper powder to have positive charges, and the earthing device is connected with metal base material and guides the positive charge of the metal base material to the earth surface, so that the metal base material is charged negatively. When the metal base material is transported by the transporter and passes through the coating device, the coating device coats metal powder with the positive charges on the metal base material with negative charges; and because of the electrostatic force adsorption effect, metal copper power is coated on the metal base material. Compared with the manual coating mode, the invention is quick and convenient and is easy to control the thickness of the film.

Description

technical field [0001] The invention relates to a thin film coating and spraying technology, in particular to a metal copper powder thin film coating equipment and coating method used on a heat dissipation plate. Background technique [0002] With the rapid development of science and technology, the development focus of electronic components is light, thin and small. With the high density of electronic components, heat dissipation is an important issue that needs to be overcome at this stage. Usually, there are light-emitting diodes in electronic components. Because light-emitting diodes It has the advantages of high luminous efficiency, small size, low power consumption, long service life, unbreakable and rich color gamut. It is widely used in light sources, but it has the disadvantage of poor heat dissipation. Therefore, the existing light-emitting diodes All will be provided with a heat sink for heat dissipation. [0003] The cooling plate is usually covered with a layer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/00B22F7/04
Inventor 陈文进陈志朗陈坤川
Owner 陈文进
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap