Lead frame structure of static release ring without paddle and production method thereof

Abstract

The invention relates to a lead frame structure of a static release ring without paddle and a production method thereof, wherein the structure comprises a static release ring (1)and a pin (2); a first metal layer (4) is arranged in front of the static release ring (1)and the pin (2) and a second metal layer (5) is arranged at the back of the static release ring (1) and the pin (2); the front side of the pin (2) extends besides the static release ring (1) possibly; the area in the periphery of the pin (2), the area between the pin (2) and the static release ring (1) and the area between the pins (2) are embedded with a plastic package (3) without stuffing; the plastic package (3) without stuffing connects the periphery below the pin, lower part of the pin (2) and lower part of the static release ring (1) and lower parts of the pins (2) into an integrated structure and makes the backside size of the static release ring (1) and the pin (2) smaller than the front side size of the static release ring (1) and the pin (1). The invention has the advantage of big binding capability of the metal pin, cost reduction, energy saving and carbon emission and wastes reduction.

Description

(1) Technical field [0001] The invention relates to a lead frame structure and a production method thereof. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] There are two main types of traditional lead frame structures: [0003] The first: [0004] After chemical etching and surface electroplating are carried out on the front of the metal substrate, a layer of high-temperature-resistant adhesive film is pasted on the back of the metal substrate to form a lead frame carrier that can be packaged (such as Figure 14 shown). [0005] The second type: [0006] After chemical etching and surface electroplating are carried out on the front side of the metal substrate, the production of the lead frame is completed (such as Figure 15 shown). The backside of the lead frame is then etched during the packaging process. [0007] However, the above two lead frames have the following disadvantages in the packaging process: [0008] Th...

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Problems solved by technology

So directly increased the high cost

[0010] 2) Also because the back of the lead frame must be affixed with a layer of high-temperature-resistant adhesive film, the chip loading process in the packaging process can only use conductive or non-conductive resin technology, and eutectic cannot be used at all. Process and soft solder process for chip mounting, so the types of products that can be selected are relatively limited

[0011] 3) Because the back of this kind of lead frame must be pasted with a layer of high temperature resistant adhesive film, and in the ball soldering bonding process in the packaging process, because the high temperature resistant adhesive film is a soft material, so It caused the instability of ball bonding parameters, which seriously affected the quality of ball bonding and the stability of product reliability.

[0016] In addition, due to the long distance between the chip and the pins, such as Figures 18-19 As shown, the length of the metal wire is longer, and the cost of the metal wire is higher (especially the expensive pure gold metal wire); also because the length of the metal wire is longer, the signal output speed of the chip is slower (because it is a memory Such products and calculations that require a large amount of data are more prominent); also because the length of the metal wire is longer, the interference of the parasitic resistance / parasitic capacitance and the parasitic pole on the signal of the metal wire is also high; and because The distance between the chip and the pins is relatively long, which makes the volume and area of ​​the package larger, the material cost is higher, and the waste is more

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