Thermosetting resin composition with high heat resistance and copper-clad laminate made of same

Abstract

The invention relates to a thermosetting resin composition with high heat resistance and a copper-clad laminate made of the same. The thermosetting resin composition with high heat resistance comprises the following components in parts by weight: 20-70 parts of brominated epoxy resin, 1-30 parts of hardener, 0-10 parts of accelerator, 0.1-20 parts of organic heat stabilizer, 0-60 parts of inorganic filler and a right amount of solvent, wherein the organic heat stabilizer is a zincous organic matter; the copper-clad laminate made of the thermosetting resin composition with high heat resistancecomprises a plurality of overlapped pregregs and copper foils clad on one side or both sides of the overlapped pregregs, and each pregreg comprises a base material and the thermosetting resin composition with high heat resistance attached to the base material through impregnation and drying. The thermosetting resin composition with high heat resistance provided by the invention is prepared from the zincous organic matter as the organic heat stabilizer, so that the prepared thermosetting resin composition has high heat resistance, and can obviously increase the heat decomposition temperature of a composite material so as to increase the heat resistance of the composite material; in addition, the copper-clad laminate made of the thermosetting resin composition with high heat resistance has good comprehensive performance and high heat resistance, and can meet the requirements of the processing and the assembly of printed circuit boards.

Description

technical field [0001] The invention relates to a thermosetting resin, in particular to a thermosetting resin with high heat resistance and a copper clad laminate made thereof. Background technique [0002] Copper-clad laminates need better heat-resistant boards in response to their processing and assembly requirements in printed circuit boards. In the industry, the temperature at which the plate loses 5% of its weight in the TGA test (also known as thermal decomposition temperature) is used to characterize the heat resistance of the plate. The higher the thermal decomposition temperature, the better the heat resistance of the plate. [0003] At present, there are several ways to improve the heat resistance of the plate in the copper clad laminate industry: [0004] 1. Use a high heat-resistant curing agent, such as phenolic resin instead of dicyandiamide, but this method will cause difficulties in curing and poor processability of the board; [0005] 2. Use high heat-resi...

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Problems solved by technology

[0004] 1. Use a high heat-resistant curing agent, such as phenolic resin instead of dicyandiamide, but this method will cause difficulties in curing and poor processability of the board;

[0005] 2. Use high heat-resistant epoxy resins, such as biphenyl-type epoxy resins, DCPD-type epoxy resins, and phenolic-type multifunctional epoxy resins, but these special epoxy resins are used in large quantities and are expensive;

[0006] 3. Add heat stabilizers, such as organic zinc ZnO. ZnO is a heat stabilizer commonly used in the rubber industry. Although it helps to improve the heat resistance of brominated epoxy resins, ZnO is an inorganic substance and is compatible with organic resins The property is not good, and the acid and alkali resistance of ZnO is poor

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