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Resin composition for printed circuit board and printed circuit board using the same

A resin composition, printed circuit board technology, applied in the direction of printed circuit dielectric, printed circuit, printed circuit, etc.

Inactive Publication Date: 2010-10-27
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Traditionally developed build-up insulation materials rely on desmearing (or decontamination, desmearing) conditions to have a peel strength of about 0.5-0.8kN / m, and can stably exhibit about 1.0kN / m or higher The strength of laminated insulation materials has not been commercialized

Method used

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  • Resin composition for printed circuit board and printed circuit board using the same
  • Resin composition for printed circuit board and printed circuit board using the same
  • Resin composition for printed circuit board and printed circuit board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] 375 g of bisphenol A epoxy resin obtained by dispersing 40 wt % of silicone elastomer particles having a core-shell structure with an average particle diameter of 1 μm in DGEBA epoxy resin with an average epoxy resin equivalent weight of 302 , 750 grams of cresol novolac epoxy resin with an average epoxy equivalent weight of 206, 375 grams of a flame retardant epoxy resin with an average epoxy equivalent weight of 590, and 992.76 grams of 66.7 wt% bisphenol A phenolic resin (novolac resin) curing agent (solvent: 2-methoxyethanol) was added to a mixed solvent of 239.54 g of MEK and 501 g of 2-methoxyethanol, and stirred at room temperature at 300 rpm. After that, 442.85 g of an inorganic filler having an irregular shape with a size distribution of 2.53 μm was added thereto, and the mixture was stirred at 400 rpm for 3 hours. Finally, 0.25 parts by weight of 2-ethyl-4-methylimidazole was added thereto, and the mixture was stirred for 1 hour, thereby preparing an insulatin...

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PUM

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Abstract

Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided.

Description

[0001] References to related applications [0002] This application claims a Korean patent application entitled "Resin composition for printed circuit board and printed circuit board using the same" filed on April 23, 2009 The benefit of No. 10-2009-0035541, the entire contents of which are incorporated into this application by reference. technical field [0003] The present invention relates to a resin composition for a printed circuit board (PCB) and a PCB using the resin composition. More specifically, the present invention relates to a resin composition for PCB and a PCB using the resin composition, the resin composition includes a silicone elastomer with a core-shell structure, so that when applied to a layer of a multilayer PCB Not only exhibits excellent thermal stability and mechanical strength but also exhibits high toughness when interlayer insulating layers are used, thereby obtaining highly reliable substrates. Background technique [0004] In response to the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C08G59/62C08L83/04C08K9/06H05K1/03
CPCH05K2201/0133H05K1/0373C08G59/304H05K2201/0212C08L63/00C08L83/04C08L2666/14C08G59/686C08K9/06
Inventor 赵在春吴浚禄朴文秀林成泽李和泳
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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