Bronze process Nb3Sn superconductor multi-core wire connector
A technology of superconductor and multi-core wire, applied in the direction of connecting contact material, connection, circuit/collector parts, etc. flow capacity, reducing the size of the joint, the effect of reducing the resistance value
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Embodiment approach 1
[0039] Embodiment 1: In this embodiment, the bronze process Nb to be connected 3 The outer diameter of the Sn superconductor multi-core wire is 0.9 mm, and the diameter of a single Nb wire is 4.5 microns. First use concentrated nitric acid to dissolve the two bronze process Nb to be connected 3 The bronze matrix at the end of the 8n superconductor multi-core wire is corroded, exposing the pure Nb wire part, and the exposed Nb wire has a length of 30 mm. Clean and dry the Nb wire at the joint. Then put the Nb wires of the superconductor multi-core wires together so that the Nb wires of the two wires overlap each other as much as possible, and bind and fix them with thin Cu wires. Then the joint is subjected to electroplating deposition Cu-Sn alloy layer treatment, the composition ratio of electroplating deposition electrolyte is: SnCl 2 2H 2 O——40 g / L, NaF——30 g / L, N(CH 2 COOH) 3 - 20 g / L, CuSO 4 ·5H 2 O——30 g / L, EDTA——45 g / L, citric acid——10 g / L, polyoxyethylene fatty ...
Embodiment approach 2
[0040] Embodiment 2: In this embodiment, the bronze process Nb to be connected 3 The diameter of the Sn superconductor multi-core wire is 0.7 mm, and the diameter of a single Nb wire is 4.5 microns. First use concentrated nitric acid to dissolve the two bronze process Nb to be connected 3 The bronze matrix part at the end of the Sn superconductor multi-core wire was corroded to expose the pure Nb wire part, and the exposed Nb wire had a length of 40 mm. Clean and dry the Nb wire at the joint. Then put the Nb filaments of the superconductor multi-core wire together so that the two Nb wires 3 The Nb wires of the Sn superconductor multi-core wire overlap each other as much as possible, and are bound and fixed with thin Cu wires. Then the joint is subjected to electroless plating deposition Cu-Sn alloy layer treatment, the composition ratio of electroless plating deposition electrolyte is: SnCl 2 2H 2 O——30 g / L, NaF——30 g / L, N(CH 2 COOH) 3 - 25 g / L, CuSO 4 ·5H 2 O——20 g / l...
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