Aldehyde-free adhesive and preparation method thereof
A technology of adhesives and oxidants, applied in the direction of adhesives, etc., can solve the problems of high price, complicated production process, and difficult to guarantee the quality of wood-based panels
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Embodiment 1
[0029] Embodiment 1, the preparation of formaldehyde-free binder
[0030] Prepare 1000 g of a colorless and transparent PVA1799 (average degree of polymerization: 1700-1850) aqueous solution with a mass percentage of 10%, add 2 g of potassium persulfate, and stir and oxidize at 50° C. for 2 hours. Then 2 grams of a 20% aluminum sulfate solution were added, as well as a solution containing 0.15 grams of borax. Stir evenly, then add 0.2% of the total system weight of sodium lauryl sulfate, stir evenly and cool down to room temperature, then add 5% flour of the total system mass, stir evenly and discharge to obtain the formaldehyde-free adhesive.
Embodiment 2
[0031] Embodiment 2, the preparation of formaldehyde-free binder
[0032] Prepare 1000 grams of a colorless and transparent PVA2099 (average degree of polymerization: 2000-2150) aqueous solution with a concentration of 20%, add 3 grams of ammonium persulfate, and oxidize under stirring for 2 hours at 60° C. Then add OP-107 grams; then add 16 grams of MDI and react at a temperature of 50° C. for 2 hours. Then add 0.4% of the total weight of the system dioctyl sodium sulfosuccinate, stir evenly and cool down to room temperature, then add 5% of the total weight of the system light calcium carbonate, stir evenly and discharge to obtain the formaldehyde-free adhesive.
Embodiment 3
[0033] Embodiment 3, the preparation of formaldehyde-free binder
[0034]Prepare 1000 g of a colorless and transparent PVA1788 (average degree of polymerization: 1700-1850) aqueous solution with a mass percentage of 15%, add 1.5 g of potassium persulfate, and stir and oxidize at 40° C. for 1.5 hours. Then add 1.5 grams of TDI (Cangzhou Dahua 80 / 20) solution, and a solution containing 0.15 grams of borax. Stir evenly, then add 0.2% of the total system weight of sodium dodecylsulfonate, stir evenly and cool down to room temperature, then add 8% of the total system mass of flour, stir evenly and discharge to obtain the formaldehyde-free adhesive.
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