Method for enhancing reliability of chip welding spot, printed circuit board and electronic device

Abstract

The invention relates to PCBA processing and discloses a method for enhancing the reliability of a chip welding spot, a printed circuit board and an electronic device. The method for enhancing the reliability of the chip welding spot comprises the following steps of: dipping an epoxy resin soldering flux on a welding foot of the chip or coating the epoxy resin soldering flux on a bonding pad corresponding to the welding foot of the chip, and attaching the chip to the bonding pad; and performing reflux treatment on the bonding pad to which the chip is attached and finishing curing the epoxy resin soldering flux. The method reduces the investment of the device and improves the manufacturing efficiency because an Underfill process is unnecessary.

Description

technical field [0001] The invention relates to the processing of assembled printed circuit board (PCBA: Printed Circuit Board Assembly), in particular to a method for enhancing the reliability of chip solder joints, a printed circuit board and electronic equipment. Background technique [0002] Multi-functionalization and miniaturization have become the main development trend and technical requirements of personal consumer electronics products such as mobile phones and wireless network cards; therefore, in order to enhance product functions and reduce product volume, consumer electronics chip manufacturers start from Pitch chip size packaging (CSP: Chip Scale Packaging) is gradually developing to 0.40mm pitch or even 0.30mm pitch CSP, and three-dimensional assembly technology such as stacked packaging (POP: Package On Package) chip stacking technology is introduced at the same time. To improve the layout density of PCBA, the thickness of printed circuit board (PCB: Printed ...

AI Technical Summary

Problems solved by technology

[0004] At the same time, because the existing solder paste printing method cannot meet the high-density printing requirements of 0.30mm pitch CSP chips, the Dipping Flux process solution is adopted, but due to reliability requirements, Underfill protection is still required after Dipping Flux Program

[0005] In the research on the prior art, the inventor found that: since the existing methods for enhancing the reliability of chip solder joints all require the Underfill process, and the Underfill process is not compatible with the SMT process, so in order to complete the Underfill, it is necessary to add after PCBA processing Underfill related equipment not only increases equipment cost investment, but also increases process flow and reduces manufacturing efficiency

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