Method for preparing iron-nickel-phosphorus chemical plating

An electroless plating, iron-nickel-phosphorus technology, which is applied in the field of chemical deposition, can solve the problems of low iron content in the coating, poor adhesion between the coating and the substrate, difficulty in obtaining a coating with uniform thickness and composition, etc. The effect of increasing the content and suppressing the reduction rate of nickel

Inactive Publication Date: 2010-12-08
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a new method for preparing the iron-nickel-phosphorus electroless coating, which solves the problems of low iron content in the coating, poor bonding between the coating and the substrate, difficulty in obtaining a coating with uniform thickness and composition, and the like. Especially suitable for preparing iron-nickel-phosphorus electroless plating with high iron content on the surface of silicon chips and copper

Method used

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  • Method for preparing iron-nickel-phosphorus chemical plating
  • Method for preparing iron-nickel-phosphorus chemical plating
  • Method for preparing iron-nickel-phosphorus chemical plating

Examples

Experimental program
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Effect test

Embodiment 1

[0033] The 10×10×1.5mm silicon chip is put into the prepared chemical plating solution of the invention after degreasing, hydrofluoric acid and nitric acid mixed solution to remove the oxide film, and palladium chloride activation treatment. The plating solution is composed of KNaC 4 h 4 o 6 4H 2O 60-80g / L, disodium edetate 2-6g / L, diethylenetriaminepentaacetic acid 2-6g / L, NaH 2 PO 2 10-15g / L, boric acid 5g / L, sodium dodecylsulfonate 0.04g / L, NH 3 ·H 2 O 90-110mL / L; in solution, Fe 2+ Added in the form of ferrous ammonium sulfate, Ni 2+ Add in the form of nickel sulfate, the total molar concentration of ferrous ammonium sulfate and nickel sulfate is 0.08-0.10mol / L, Fe 2+ / Ni 2+ The molar ratio is 4 / 1.

[0034] Cover the plating solution with xylene, put it in a water bath at 60°C, and react for 1 hour, the thickness of the coating is about 7-10 μm, and the surface appearance of the coating is as follows: figure 1 As shown, the coating chemical composition is as fi...

Embodiment 2

[0036] The 10×10×1.5mm silicon chip is put into the prepared plating solution of the invention after degreasing, hydrofluoric acid and nitric acid mixed solution to remove the oxide film, and palladium chloride activation treatment. The plating solution is composed of KNaC 4 h 4 o 6 4H 2 O 60-80g / L, disodium edetate 2-4g / L, diethylenetriaminepentaacetic acid 2-4g / L, NaH 2 PO 2 10-15g / L, boric acid 5-8g / L, sodium dodecylsulfonate 0.04g / L, NH 3 ·H 2 O 90-110mL / L; in solution, Fe 2+ Added in the form of ferrous ammonium sulfate, Ni 2+ Add in the form of nickel sulfate, the total molar concentration of ferrous ammonium sulfate and nickel sulfate is 0.06-0.08mol / L, Fe 2+ / Ni 2+ The molar ratio is 4 / 1.

[0037] Cover the plating solution with xylene, put it in a water bath at 90° C., and react for 30 minutes. The thickness of the coating is about 6 μm, and the composition of the obtained coating is: 71.90Ni23.32Fe4.78P (atomic percent).

Embodiment 3

[0039] The 10×10×1.5mm silicon chip is put into the prepared plating solution of the invention after degreasing, hydrofluoric acid and nitric acid mixed solution to remove the oxide film, and palladium chloride activation treatment. The plating solution is composed of KNaC 4 h 4 o 6 4H 2 O 60-80g / L, glycamino acid 2-4g / L, iminoacetic acid 2-4g / L, NaH 2 PO 2 10-15g / L, boric acid 5-8g / L, sodium dodecylsulfonate 0.04g / L, NH 3 ·H 2 O 90-110mL / L; in solution, Fe 2+ Added in the form of ferrous ammonium sulfate, Ni 2+ Add in the form of nickel sulfate, the total molar concentration of ferrous ammonium sulfate and nickel sulfate is 0.10-0.12mol / L, Fe 2+ / Ni 2+ The molar ratio is 9 / 1.

[0040] Cover the plating solution with xylene, put it in a water bath at 70° C., and react for 30 minutes. The thickness of the coating is about 5 μm, and the composition of the obtained coating is: 68.44Ni13.95Fe17.61P (atomic percentage).

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Abstract

The invention belongs to the technical field of chemical deposition, in particular to a new method for preparing an iron-nickel-phosphorus chemical plating. The plating can be widely used in (micro) electronic industry and space navigation and general projects. In the method, a compound complex system consisting of sodium potassium tartrate tetrahydrate, trisodium citrate, two organic mixed additives having N(CH2COOH)2 groups and ammonia water is used for controlling Fe<2+> and Ni<2+> concentrations, reducing the reduction speed of nickel and improving the reduction speed of iron so as to improve the iron content of the plating; the compound complex system can be complexed with impurity ions to improve the containable metal impurity ion concentration of the solution. The method is particularly suitable for preparing high-iron content iron-nickel-phosphorus chemical plating on silicon chips or copper surfaces. The plating on a silicon chip surface comprises 0 to 50 percent (controllable) of iron atoms, 2 to 18 percent of phosphorus atoms and the balance of nickel; and the plating on a copper surface contains 0 to 90 percent (controllable) of iron atoms, 2 to 16 percent of phosphorus atoms and the balance of nickel.

Description

technical field [0001] The invention belongs to the technical field of chemical deposition, and specifically relates to a new method for preparing an iron-nickel-phosphorus chemical coating, which can be widely used in (micro)electronic industry, aerospace and general engineering. Background technique [0002] Iron-nickel alloy has excellent soft magnetism, weldability and low thermal expansion coefficient, and its thermal expansion coefficient can be adjusted by changing the coating composition to achieve thermal matching with various materials (especially silicon chips); in addition, the iron-nickel-phosphorus coating The interfacial reaction rate with tin-based solder is lower than that of nickel-phosphorus plating. Based on these characteristics, the Fe-Ni coating has broad application prospects in (micro) electronics industry, aerospace and general engineering. Because the electroless plating technology has the characteristics of low cost, environmental protection, sim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/34C23C18/36
Inventor 周海飞郭敬东尚建库
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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