Unleaded solder paste and preparation method thereof

A lead-free solder paste, polymerized rosin technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of poor solderability and printability, high cost of solder paste, short service life, etc., and achieve an increase in expansion rate. , the effect of increasing storage life and reducing costs

Inactive Publication Date: 2011-01-05
常州市亚太微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The technical problem to be solved by the present invention is: to overcome the technical problems of high cost, short service life, poor weldability and printability of the existing solder paste, and to provide a solder paste with low production cost, long storage life, good solderability and Printable lead-free solder paste

Method used

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  • Unleaded solder paste and preparation method thereof
  • Unleaded solder paste and preparation method thereof
  • Unleaded solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Take polymerized rosin, hydrogenated rosin, modified hydrogenated castor oil, organic acid active agent, surfactant, softening agent, accelerator, antioxidant, organic solvent in weight percent as polymerized rosin: 20%, hydrogenated rosin: 10%, modified rosin Hydrogenated castor oil: 3%, organic acid active agent: 15%, surfactant 15%, softener epoxy soybean oil: 5%, accelerator: 0.2%, antioxidant: 0.2%, halogen active agent: 0.01%, organic solvent: 31.59%.

[0026] First add polymerized rosin and hydrogenated rosin into organic solvent, dissolve at about 100°C, add organic acid into the dissolved matter, add modified hydrogenated castor oil after it dissolves, add surfactant and stir evenly after cooling to about 70°C, add The accelerator and softener are stirred until dissolved, and the solder paste is obtained after cooling.

[0027] Weigh the above-mentioned solder paste into the cylinder according to the proportion of 10% flux, enter the pre-stirring state at a sp...

Embodiment 2

[0033] Get polymerized rosin, hydrogenated rosin, modified hydrogenated castor oil, organic acid active agent, surfactant, softening agent, accelerator, antioxidant, organic solvent in weight percent as polymerized rosin: 25%, hydrogenated rosin: 19%, modified rosin Hydrogenated castor oil: 5%, organic acid active agent: 10%, surfactant 4%, softener epoxy soybean oil: 7%, accelerator: 0.5%, antioxidant: 0.3%, halogen active agent: 0.01%, organic solvent: 29.19%.

[0034] First add polymerized rosin and hydrogenated rosin into organic solvent, dissolve at about 100°C, add organic acid into the dissolved matter, add modified hydrogenated castor oil after it dissolves, add surfactant and stir evenly after cooling to about 70°C, add The accelerator and softener are stirred until dissolved, and the solder paste is obtained after cooling.

[0035] Weigh the above-mentioned solder paste into the cylinder according to 11% flux, enter the pre-stirring state at a speed of 23 rpm, and t...

Embodiment 3

[0042] Take polymerized rosin, hydrogenated rosin, modified hydrogenated castor oil, organic acid active agent, surfactant, softening agent, accelerator, antioxidant, organic solvent in weight percent as polymerized rosin: 30%, hydrogenated rosin: 15%, modified Hydrogenated castor oil: 5.5%, organic acid active agent: 9%, surfactant 3%, softener: 6%, accelerator: 0.6%, antioxidant BHT: 0.35%, halogen active agent: 0.01%, Organic solvents: 30.54%.

[0043] First add polymerized rosin and hydrogenated rosin into organic solvent, dissolve at about 100°C, add organic acid into the dissolved matter, add modified hydrogenated castor oil after it dissolves, add surfactant and stir evenly after cooling to about 75°C, add The accelerator and softener are stirred until dissolved, and the solder paste is obtained after cooling.

[0044] Weigh the above-mentioned solder paste into the cylinder according to the proportion of ingredients of 11.5%, and enter the pre-stirring state at a spee...

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Abstract

The invention relates to an unleaded solder paste and a preparation method thereof. The unleaded solder paste comprises the following raw materials in percentage by weight: 20-35% of polymerized rosin, 10-25% of hydrogenated rosin, 3-8% of modified hydrogenated castor oil, 5-15% of organic acid active agent, 4-15% of surfactant, 5-10% of softening agent, 0.2-2% of accelerating agent, 0.2-2% of antioxidant, 0.01-0.02% of halogen-containing active agent and the balance organic solvent. The unleaded solder paste can be prepared by the steps of weighting the above raw materials, stirring and vacuumizing. The unleaded solder paste in the invention adopts domestic rosin, thus greatly lowering the cost; the ratio of the organic acid is regulated, thus improving the expansion ratio of the solder paste and having good printing property; and epoxidized soybean oil is adopted as the softening agent to regulate the viscosity of the solder paste, thus increasing the storage life of the solder paste.

Description

technical field [0001] The invention relates to a lead-free solder paste and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material developed with surface mount technology. It is an extremely important auxiliary material in the production of electronic products today. Its quality is directly related to the quality of surface mount components, so it has been favored by the electronics industry. Widespread attention. At present, the traditional SnPb-based leaded solder and solder powder are still widely used in the electronics industry, and the technology in this environment is quite mature. However, with the rapid development of the electronics industry and the enhancement of global environmental protection awareness, the environmental and health problems caused by SnPb solder have increasingly attracted the attention of "green organizations", and governments of various countries have issued relevant laws and regulations ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/363
Inventor 袁荷芳常小青
Owner 常州市亚太微电子材料有限公司
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