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Test data compression method of integrated circuit test

A test data and compression method technology, applied in the field of test data compression, can solve the problems of few chip test points, inability to perform full-speed test, large volume, etc., and achieve the effect of solving storage problems

Inactive Publication Date: 2011-02-09
ANQING NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. There are few test points on the chip, and the test points that can be directly controlled or observed are limited. Usually, it can only be tested through the limited input / output pins of the chip, and it is difficult to directly control or observe the internal nodes of the chip through macro mechanical devices.
[0004] 2. Automatic test equipment (ATE) is expensive, and the development speed of chip design and manufacturing technology is faster than that of ATE. The clock frequency of the chip has exceeded the frequency of the most advanced ATE at present, and full-speed testing cannot be performed.
[0005] 3. The amount of test data is large. The more IP integrated in the SoC, the greater the amount of test data required
[0010] In the traditional method, these seeds or code words (compressed form) are all directly (statically) stored in the ATE memory, and the storage capacity it occupies will increase with the increase of the original test data volume, although the ATE The storage is in a compressed form, but its volume is still large, so the increasing amount of test data poses a challenge to ATE storage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The specific steps to transform the storage of the entire test set into the storage of one or several corresponding irrational numbers are:

[0023] a. Use the automatic test pattern generation tool ATPG to generate a certain complete test set T, and record the number of test vectors as N;

[0024] b. Concatenate all test vectors, that is, connect the tail of one vector to the head of another vector;

[0025] c. Don't care bit filling. Fill the irrelevant bits from the beginning in order. The principle of filling is: if the number of the irrelevant bit and the previous consecutive 0s is less than the specified constant K, then the irrelevant bit is filled with 0; otherwise, the irrelevant bit is filled with 1; K is equal to the original the maximum run length in the test data;

[0026] d. Count the length of the run, and count the length of the run from the beginning in order;

[0027] e. Convert to a decimal, and convert the run length information into a decimal to ...

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PUM

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Abstract

The invention provides a test data compression method of an integrated circuit test, which adopts an original test data storing law and then reduces the original test data storing law to obtain needed original test data when the test is applied, that is to say, the storage of the integral original test data is changed into the storage of one or a plurality of corresponding irrational numbers. The test data compression method of the integrated circuit test particularly comprises the following steps of: generating a determined complete test set recorded as a test vector set by adopting an automatic test mode generation tool; cascading all test vectors; filling independent bits; counting a run-length; transforming into decimal numbers; and transforming into the irrational numbers. The invention has the advantages of theoretically unlimitedly compressing the test data by changing the storage of codes of the integral test set into the storage of an encoding law and fundamentally solving the problem of storage of the test data.

Description

【Technical field】 [0001] The invention relates to an integrated circuit testing technology, in particular to a method for compressing test data in a built-out self-test (Built-Out Self-Test, BOST) method for a system chip (System-on-a-Chip, SoC). 【Background technique】 [0002] The development of integrated circuit technology makes it possible to integrate hundreds of millions of devices in one chip, and can integrate pre-designed and verified IP, such as memory, microprocessor, DSP, etc. Such a diversified integrated chip has become an integrated system capable of processing various information, and is called a system on chip or system chip (SoC). SoC greatly reduces the system cost, shortens the design cycle, and speeds up the time to market, but the testing of SoC products faces more and more challenges, such as: [0003] 1. There are few test points on the chip, and the test points that can be directly controlled or observed are limited. Usually, it can only be tested t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 詹文法马俊石冰韩建华孙秀芳
Owner ANQING NORMAL UNIV
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