Precise technology for correcting cutting angles of quartz crystal wafers in large scale

Abstract

The invention provides a precise technology for correcting cutting angles of quartz crystal wafers in large scale. The technology comprises the following steps: carrying out X-ray angle detection on the cutting angles of the quartz crystal wafers to directionally mark the quartz crystal wafers; grading the quartz crystal wafers according to angle ranges; combining the quartz crystal wafers withinthe same-grade angle range in pairs, misplacing each group of quartz crystal wafers and then adhering, wherein the misplaced widths of each group of quartz crystal wafers are consistent; grinding each group of adhered quartz crystal wafers in a double-face grinding device in batches; carrying out X-ray angle detection on the cutting angles of the quartz crystal wafers during grinding, completing the primary correction of the cutting angles of the quartz crystal wafers in batches when the angles meet requirements, and then taking the wafers down; and separating each group of quartz crystal wafers in pairs, placing the angle-correcting grinding surfaces of the quartz crystal wafers downwards on the lower disc face of the double-face grinding device, and carrying out double-face grinding on the quartz crystal wafers until two main surfaces of each quartz crystal wafer are parallel.

Description

Technical field [0001] The invention involves a correction production process of a chip angle after crystal cutting. Specifically, it involves a large -scale accurate correction process of a quartz chip cut angle. Background technique [0002] Now the quartz resonant, quartz oscillator, optical low -pass filter used in the field of electronic information technology and optoelectronics applications are the main forms of chips that are sliced, directional screening, angle correction, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding, grinding,After the main processes such as shape processing, the differential fields determine that the angle of the required cutting chip is also different. The higher accuracy requires the cutting angle error within 15 seconds. Generally, it is within 5 points.The understanding is the angle of the cutting direction and the d...

AI Technical Summary

Problems solved by technology

[0006] The problems existing in the traditional process are: each piece of adhesive covering needs to be protected before corrosion, the operation is cumbersome, the larger the correction angle, the greater the corrosion amount, and the corrosion rate is very slow due to the increase in the corrosion amount. Correction 10 It takes about 8 hours; and the long-term corrosion will damage the shape of the wafer, and also cause internal damage to the inside of the wafer, so this process is only suitable for precision angle correction of wafers with small angle deviations, such as within 3 minutes

[0007] Pad correction process for wafers, the method is similar to the principle of corrosion correction process, and does not have the ability of mass production

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