Vao productivity suite

A productivity, facility technology, applied in the field of semiconductor fabrication facility visualization systems, semiconductor fabrication facility productivity systems, and monitoring semiconductor fabrication facility operations, to address issues such as increasing cycle time control complexity

Active Publication Date: 2011-02-16
MURATA MASCH LTD
View PDF6 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, fabrication of smaller technology node devices with reduced linewidths may require more processing steps, whi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vao productivity suite
  • Vao productivity suite
  • Vao productivity suite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be evident, however, that one skilled in the art may practice the present invention without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.

[0022] Abbreviation definition

[0023] ●AGV: automated guided vehicle

[0024] ●AMHS: Automatic Material Handling System

[0025] ● BKM: Best Known Method - Industry Best Practice

[0026] ●DB: database

[0027] ●EDA: Electronic Design Automation

[0028] • EFEM: Equipment Front End Module - In automated semiconductor equipment, this tool section moves wafers between transports on load ports towards load and / or process chambers.

[0029] • FDIM: Plant Data Integration Manager - a product that reconciles equipment data with plant data systems. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A semiconductor fabrication facility (fab) configuration module is defined to virtually model physical systems and attributes of a fab. A data acquisition module is defined to interface with the physical systems of the fab and gather operational data from the physical systems. A visualizer module is defined to collect and aggregate the operational data gathered from the physical systems. The visualizer module is further defined to process the operational data into a format suitable for visual rendering. The processed operational data is displayed within a visual context of the fab in a graphical user interface controlled by the visualizer module. An analyzer module is defined to analyze data collected by the visualizer module and to resolve queries regarding fab performance. An optimizer module is defined to control systems within the fab in response to data collected by the visualizer module, data generated by the analyzer module, or a combination thereof.

Description

Background technique [0001] Modern semiconductor factories use a variety of automation systems from multiple independent suppliers. As used herein, the terms semiconductor factory and semiconductor fabrication facility are synonymous and are abbreviated as factory and fabrication facility, respectively. The various self-contained automation systems include hardware and software that are interfaced to work together to automate the movement of materials, data, and controls through a manufacturing facility. The main independent automation systems in manufacturing facilities include: MES (Manufacturing Execution System, Manufacturing Execution System), AMHS (Automated Material Handling System, Automatic Material Handling System), MCS (Material Control System, Material Control System) for tool connectivity Station control devices, EFEM (Equipment Front-End Modules, equipment front-end modules) and load ports for the interface between factory tools and AMHS, material tracking syste...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F19/00G06F17/50G06Q50/00G06F17/00
CPCG05B2219/31334G05B19/41885G05B2219/45031G05B2219/31466H01L21/67276Y02P90/02Y02P90/80
Inventor 卡尔·谢迈克尔·A·库克森诺尔玛·B·赖利唐纳德·雷克斯·赖特约瑟夫·约翰·法图拉
Owner MURATA MASCH LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap