Near-infrared room temperature luminescent device based on automatic ion implantation of SOI (silicon on insulator) material
A light-emitting device and near-infrared technology, which is applied in the field of optoelectronics, can solve problems such as no public reports, and achieve the effects of simple process, improved external quantum efficiency, and low power consumption
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Embodiment 1
[0018] The present invention is by injecting Si into the silicon film layer of SOI structure + , to obtain efficient D at room temperature 1 Line light-emitting device, the specific steps are as follows:
[0019] Step 1: Select a P-type single crystal Si wafer with a crystal orientation of (100), polish it on one side, and clean the substrate with the existing technology.
[0020] Step 2: Prepare thin film surface silicon layer and SiO with uniform thickness by SIMOX method 2 buried layer.
[0021] Step 3: Si + Ion implanted silicon thin film layer
[0022] Si by ion implanter + Self-implanted silicon thin film layer, the injection dose is 10 12 cm -2 , the injection energy is 200keV. Si + After the ion implantation is completed, the S + Ions were implanted into this layer, and the implantation energy and dose were 80keV and 10 14 cm -2 , S + Due to diffusion will form n + type layer. The included angle between the ion beam and the surface normal of the silicon ...
Embodiment 2
[0028] Step 1, step 2, step 4, and step 5 are the same as in embodiment 1.
[0029] The difference in step 3 is:
[0030] Si by ion implanter + Self-implanted silicon thin film layer, the injection dose is 10 14 cm -2 , the injection energy is 200keV.
Embodiment 3
[0032] Basically with embodiment 1. The differences are:
[0033] Si by ion implanter + Self-implanted silicon thin film layer, the injection dose is 10 16 cm -2 , the injection energy is 200keV.
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