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Micro lens structure, micro lens technology and bank pattern applied to micro lens technology

A technology of microlens and process, which is applied in the direction of application, lens, photoplate making process of pattern surface, etc. It can solve the problems of adhesive residue, waste, and affecting the light transmission effect of microlens

Inactive Publication Date: 2012-03-14
HIMAX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that after the microlens array is completed, there will be cured adhesive residue between each microlens, and the adhesive remaining around the microlens may affect the light transmission effect of subsequent microlenses, and the remaining adhesive The agent is also a waste of raw materials

Method used

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  • Micro lens structure, micro lens technology and bank pattern applied to micro lens technology
  • Micro lens structure, micro lens technology and bank pattern applied to micro lens technology
  • Micro lens structure, micro lens technology and bank pattern applied to micro lens technology

Examples

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Embodiment Construction

[0015] Figure 1 to Figure 5 It is a schematic diagram of a microlens process according to an embodiment of the present invention, Image 6 is a top view of a substrate according to an embodiment of the present invention, Figure 7 and Figure 8 They are respectively a top view and a side view of another embodiment of the present invention.

[0016] refer to figure 1 with Image 6 Firstly, a substrate 10 is provided on which a microlens predetermined area A and a surrounding area B are defined. The substrate 10 only shows three microlens predetermined areas exemplary, but it may include tens of thousands or millions of microlenses in actual implementation. Microlens predetermined area. The substrate 10 can be, for example, a glass substrate or a silicon substrate, and can be applied to image sensor chip components, LED chip components, or solar cell chip components of digital cameras. Next, a photoresist layer (not shown) is formed to fully cover the substrate 10, and th...

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Abstract

The invention discloses micro lens technology, which comprises the following steps of: firstly, providing a substrate comprising a micro lens preset area and a peripheral area, and providing an imprint mold comprising a lens molding area; secondly, forming a first bank material layer in the peripheral area of the substrate, making the first bank material layer surround the micro lens preset area,and forming a micro lens material layer in the micro lens preset area; thirdly, performing an imprinting program, contacting the micro lens material layer through the lens molding area of the imprintmold, and imprinting a transition micro lens structure; fourthly, performing curing treatment and making the transition micro lens structure cured so as to form a micro lens; and fifthly, removing the imprint mold.

Description

technical field [0001] The invention relates to a microlens manufacturing method and its structure, in particular to a microlens manufacturing method and its structure using a bank material layer to avoid adhesive residue. Background technique [0002] The microlens array element is made of many curved microstructure patterns on a transparent substrate, which has the function of refracting light and focusing light beams. It can be applied to optoelectronic components, such as image sensors for digital cameras, light-emitting diodes, or Solar battery. [0003] For example, adding a microlens to the light-emitting surface of a light-emitting diode can effectively reduce total reflection and waveguide effect, thereby improving the light-emitting efficiency of a light-emitting diode; adding a microlens to the light-receiving surface of a solar cell can Improve light absorption efficiency and photoelectric conversion efficiency; add microlenses to the photodetector to focus the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B3/00G03F7/00
CPCB29D11/00298B29D11/00365
Inventor 萧运联
Owner HIMAX TECH LTD
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