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Destressing construction technique for non-substrate molding package

A technology for substrates and components, applied in microstructure technology, processes for producing decorative surface effects, decorative arts, etc., to achieve the effect of reducing mechanical boundary surfaces and thermal mismatches

Inactive Publication Date: 2011-04-13
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has not been known so far how this enables the construction of the free space of the components

Method used

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  • Destressing construction technique for non-substrate molding package
  • Destressing construction technique for non-substrate molding package
  • Destressing construction technique for non-substrate molding package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] figure 1 A substrate 1 with an adhesive film 2 is shown, and the adhesive film 2 is coated with a resin-coated copper film 3. As shown in the enlarged view, the resin-coated copper film 3 here includes an epoxy layer 3a and a copper layer 3b. The epoxy layer 3a contained in the resin-coated copper film 3 is located on the copper layer 3b, and in this case is formed as the side surface provided for the covering of the element.

[0055] figure 2 The step of applying the thermally decomposed polymer 7 is shown. On the substrate 1 with the resin-coated copper film 3, the micro / nano structured elements 4, 4'are coated on the epoxy layer 3a of the resin-coated copper film 3. The elements 4, 4'have contact points 5, 5'assigned to them, which are located inside the epoxy layer 3a. In this embodiment, element 4 is a MEMS chip, and element 4'is an ASIC chip. The ASIC chip 4'is covered by a mask 6. The thermally decomposed polymer 7 is applied to the element device by means of a...

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PUM

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Abstract

The present invention relates to a destressing construction technique for a non-substrate molding package. A method for manufacturing a component including a microstructured or nanostructured components comprises the following steps: providing a substrate (1); coating at least one microstructured or nanostructured component (4,4') on the substrate (1); packaging the coated microstructured or nanostructured component (4,4') with thermal decomposable polymer; and heating the obtained device to a temperature above a temperature, namely, the thermal decomposable polymer (7) is thermally decomposed in the method and is partially converted to gas component at least in the temperature, and additionally the temperature is selected so that other material of the obtained device is not converted to the gas component.

Description

Technical field [0001] The present invention relates to a method for manufacturing a component including a micro / nano structured (mikro-oder nanostrukturiert) element. The method includes the step of packaging the components of the micro / nano structure. The invention also relates to a component obtained by the method and its application. Background technique [0002] The sensor is usually packaged in an encapsulated housing (molded housing) based on a stamped grid or substrate. On substrates based on copper-plastic shells (copper lead frames), they can be used as examples, including leaded (leaded housing) or leadless housings (leadless housing). Here, each sensor or ASIC (application specific integrated circuit) is packaged on a substrate side by side or on top of each other, and then potting is performed on the substrate. However, more and more new substrate-free enclosures are being developed. A variation of chip packaging is called eWLP (Buried Wafer Level Packaging). [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B81B7/00
CPCH01L2224/04105H01L2924/01082H01L2924/01033H01L24/18H01L21/561H01L2924/01027H01L21/568H01L2224/20B81C2203/0154H01L23/3121H01L2924/19041H01L2924/01029B81C1/00325H01L2924/01006H01L25/50H01L24/19H01L2924/1433H01L25/16H01L2924/14G01P15/0802H01L2924/12044G01P1/023H01L2224/24137H01L2224/82H01L2924/1301H01L2924/1461H01L2924/181H01L2924/18162H01L2924/00
Inventor R·埃伦普福特F·哈格
Owner ROBERT BOSCH GMBH