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Thermosetting die bonding film, dicing die bonding film and semiconductor device

A chip-bonding film, thermosetting technology, applied in the direction of film/sheet adhesive, pressure-sensitive film/sheet, semiconductor devices, etc., can solve the problem of reducing cutting speed, inter-adherence, and adhesion of chips to semiconductor chips side, rising costs and other issues

Active Publication Date: 2011-04-13
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the general dicing method using a diamond dicing blade, there are concerns about adhesion between the die-bonding film and the dicing film due to the influence of heat generated during dicing, adhesion between semiconductor chips due to generation of swarf, and adhesion of swarf to the dicing film. The side of the semiconductor chip, etc., therefore, it is necessary to reduce the cutting speed, resulting in an increase in cost

Method used

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  • Thermosetting die bonding film, dicing die bonding film and semiconductor device
  • Thermosetting die bonding film, dicing die bonding film and semiconductor device
  • Thermosetting die bonding film, dicing die bonding film and semiconductor device

Examples

Experimental program
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Effect test

Embodiment 1

[0145] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0146] (a) Epoxy resin (manufactured by JER Corporation, Epicoat 1004, melting point 97°C)

[0147] 113 parts by weight

[0148] (b) Phenolic resin (Mirex XLC-4L, manufactured by Mitsui Chemicals, Inc., melting point: 59° C.) 121 parts by weight

[0149] (c) 100 parts by weight of an acrylic polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Nagase Chemtex Co., Ltd., WS-023)

[0150] (d) Spherical silica (manufactured by Admatex Co., Ltd., SO-25R)

[0151] 37 parts by weight

[0152] After coating this adhesive composition solution on a release-treated film (release liner) composed of a polyethylene terephthalate film with a thickness of 50 μm after silicone release treatment, the solution was heated at 130° C. ...

Embodiment 2

[0154] In this Example 2, except having changed the addition amount of the spherical silica of said (d) into 222 weight part, it carried out similarly to the said Example 1, and produced the die-bonding film B of this Example.

Embodiment 3

[0156] In this Example 3, except having changed the addition amount of the said (d) spherical silica to 779 weight part, it carried out similarly to the said Example 1, and produced the die-bonding film C of this Example.

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Abstract

An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J / mm2 or less and the elongation at break is 40% or more to 500% or less at room temperature before thermal setting.

Description

technical field [0001] The present invention relates to a thermosetting die-bonding film used when adhesively fixing a semiconductor element such as a semiconductor chip to an adherend such as a substrate or a lead frame. Moreover, this invention relates to the dicing / die-bonding film which laminated|stacked this thermosetting type die-bonding film and a dicing film. In addition, the present invention relates to a semiconductor device manufactured using the thermosetting die-bonding film or the dicing / die-bonding film. Background technique [0002] Conventionally, in the manufacturing process of a semiconductor device, a silver paste has been used to fix a semiconductor chip to a lead frame or an electrode member. The fixing process is performed by applying a paste-like adhesive on a die pad of a lead frame, etc., mounting a semiconductor chip thereon, and then curing the paste-like adhesive layer. [0003] However, the paste-like adhesive has large variations in the coati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J161/06C09J163/00C09J133/00H01L21/68H01L21/78C09J7/22C09J7/38
CPCH01L2224/48227H01L2224/32245H01L2224/48247H01L2221/68336H01L2924/01012H01L2924/3025H01L21/78H01L2224/8385H01L2924/01015H01L24/45H01L24/83H01L2924/01047H01L2224/85207C09J2461/00H01L2924/07802H01L2224/45144H01L2224/32225H01L2924/10253H01L2224/45147H01L2224/73265C09J2463/00H01L2924/15747H01L21/6836C09J7/0207H01L2224/45124C09J7/0246C09J2433/00C09J2203/326H01L2221/68381H01L24/73H01L2924/181C09J7/38C09J7/22H01L2924/00H01L2924/3512H01L2924/00012H01L2924/00014
Inventor 林美希田中俊平大西谦司宍户雄一郎井上刚一
Owner NITTO DENKO CORP