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Temperature-equalizing plate and manufacture method thereof

A manufacturing method and technology of vapor chambers, which are applied to lighting and heating equipment, coatings, indirect heat exchangers, etc., can solve the problems of increased contact thermal resistance and damage to the mechanical strength of the chamber shell, so as to improve production efficiency, The effect of improving product competitiveness and shortening production man-hours

Active Publication Date: 2011-04-20
PEGATRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of capillary structure also has the problem that the sintering process destroys the mechanical strength of the vapor chamber shell and increases the contact thermal resistance.

Method used

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  • Temperature-equalizing plate and manufacture method thereof
  • Temperature-equalizing plate and manufacture method thereof
  • Temperature-equalizing plate and manufacture method thereof

Examples

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Embodiment Construction

[0022] A specific embodiment according to the present invention is a method for manufacturing a temperature chamber. see figure 2 , figure 2 It is a flowchart of a manufacturing method of a temperature chamber according to a specific embodiment of the present invention. The method first executes step S21, providing an upper cover and a lower cover. For example, the manufacturer can use metal plates such as copper, aluminum, and stainless steel as materials to manufacture the upper cover plate 32 as shown in FIG. 3(A) through forging, extrusion, or casting. According to a preferred embodiment, the upper cover plate 32 is made by cold forging and stamping, but it is not limited thereto. In addition, the plurality of columnar structures below the upper cover 32 can be used as a supporting structure 32A separating the upper cover 32 and the lower cover 34 .

[0023] FIG. 3(B) shows another example of the upper and lower cover plates according to the present invention. In th...

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PUM

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Abstract

The invention provides a temperature-equalizing plate and a manufacture method thereof. The manufacture method of the temperature-equalizing plate comprises the following steps of: firstly, providing an upper cover plate and a lower cover plate; secondly, forming a capillary structure on the lower cover plate through a cold-melting spraying procedure; thirdly, assembling the upper cover plate and the lower cover plate to form at least one containing space in which the capillary structure is positioned; and finally, sealing the containing space after filling working fluid in the containing space. Thus, the temperature-equalizing plate manufactured with the manufacture method of the invention comprises a shell, the working fluid and the capillary structure, wherein the containing space is formed in the shell, the working fluid is filled in the containing space, and the capillary structure is formed on the inner wall of the containing wall through the cold-melting spraying procedure.

Description

technical field [0001] The present invention relates to heat conducting devices, and in particular to vapor chambers that can be used to dissipate heat from electronic systems. Background technique [0002] Vapor chamber is a kind of heat pipe. Because of its excellent heat conduction characteristics, it is widely used to cool high-power semiconductor chips, such as central processing units and graphics processing in electronic systems. devices, or high-power light-emitting diodes. By quickly taking the heat generated in the operation of semiconductor chips away from its working environment, it can ensure the efficient operation of electronic systems under normal conditions. [0003] The outer casing of the vapor chamber is usually made of metals such as copper, aluminum, and stainless steel, and the inner space is filled with a working fluid whose chemical properties are compatible with the metal. figure 1 A schematic diagram of a typical vapor chamber is shown. like fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/26C23C4/00C23C4/18C23C4/04F28D15/04H05K7/20H01L23/46
CPCF28D15/0233F28D15/046
Inventor 刘睿凯钟兆才
Owner PEGATRON
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