Copper-clad board and production method thereof

A manufacturing method and technology of copper clad laminates, applied in chemical instruments and methods, lamination auxiliary operations, lamination, etc., can solve the problem of affecting the heat resistance and electrical reliability of printed circuit boards of copper clad laminates, and the white spots of substrate texture , Low resin content and other issues, to achieve the effect of improving heat resistance and electrical reliability, low bending strength, good bendability and flexibility

Inactive Publication Date: 2011-04-27
GUANGDONG SHENGYI SCI TECH
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Problems solved by technology

[0002] The prepreg on the surface of the base material of traditional FR-4, CEM-3 and other copper clad laminates is made of glass fiber cloth (referred to as glass fiber cloth) as a reinforcing material. Due to the weaving characteristics of glass fiber cloth - there will be Overlapping, the resin content at the overlapping place is relatively low, and the thickness of the resin layer is thinner than other positions. When th

Method used

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  • Copper-clad board and production method thereof
  • Copper-clad board and production method thereof
  • Copper-clad board and production method thereof

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Embodiment Construction

[0025] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Such as figure 1 As shown, the copper clad laminate of an embodiment of the present invention includes: at least one layer of glass fiber cloth reinforced prepreg 30, glass fiber paper reinforced prepreg 20 coated on both sides of the glass fiber cloth reinforced prepreg 30, and coated on the glass fiber cloth reinforced prepreg 30. The fiber paper reinforces the copper foil 10 on both sides of the prepreg 20 . In this embodiment, the glass fiber cloth reinforced prepreg 30 has three layers. The copper clad laminate has a low bending strength of 40000-60000PSI (276-414MPa).

[0027] The glass fiber cloth reinforced prepreg 30 includes glass fiber cloth and resin attached thereto after being impregnated and dried, and the glass fiber paper reinforced prepreg 20 includes glass fiber paper and resin attached thereto after impregnated and dried. The resin conte...

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Abstract

The invention relates to a copper-clad board and a production method thereof. The copper-clad board comprises at least one layer of glass fiber-reinforced prepreg, glass fiber paper-reinforced prepregs and copper foils, wherein the glass fiber paper-reinforced prepregs are compounded on two sides of the glass fiber-reinforced prepreg; and the copper foils are compounded on the glass fiber-reinforced prepreg. The copper-clad board has a novel structure; compared with the traditional FR-4(Fiber Epoxy Resin-4), CEM-3 (Composite Epoxy Material Grade-3) and the like, the copper-clad board has the advantages that the probability of weavy grain white points of a substrate is greatly reduced and the heat resistance and the electrical reliability of the copper-clad board are improved; and the copper-clad board has lower bending strength and better bendability and flexibility and better meets the requirement for the development of the modern electronic technology. In addition, the production method of the copper-clad board is simple and feasible.

Description

technical field [0001] The invention relates to a copper clad laminate, in particular to a copper clad laminate with a novel structure and a manufacturing method thereof. Background technique [0002] The prepreg on the surface of the base material of traditional FR-4, CEM-3 and other copper clad laminates is made of glass fiber cloth (referred to as glass fiber cloth) as a reinforcing material. Due to the weaving characteristics of glass fiber cloth - there will be Overlapping, the resin content at the overlapping place is relatively low, and the thickness of the resin layer is thinner than other positions. When the thickness of the resin layer on the surface of the glass fiber cloth is less than 5 μm, it is easy to appear at the interface position in contact with the copper foil. point. However, the appearance of textured white spots on the CCL substrate will affect the heat resistance and electrical reliability of the CCL and even the printed circuit board. In the conte...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/20B32B17/04B32B37/10B32B38/08
Inventor 马栋杰吴小连黄伟壮
Owner GUANGDONG SHENGYI SCI TECH
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