Seamless belt and preparation method thereof
A manufacturing method and seamless belt technology, which can be applied to belts, transmission belts, and other household appliances, can solve the problems of reducing heat resistance and durability, and achieve excellent semi-conductivity and resistance uniformity, heat resistance and durability. excellent effect
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Embodiment 1
[0046] Mix 1480g of DMF and 1.96g of carbon nanotubes (nanocarbon company, specifications Powder Dual structure CNT 50 multi-walled carbon nanotubes) and 1.96g of DMF in a 2L capacity four-neck flask equipped with a mechanical stirrer, reflux condenser and nitrogen inlet. PEG400 (as a dispersant), nitrogen flow was made to flow in, after 30 minutes of ultrasonic dispersion with 200W, 40kHz, in the RC5C centrifuge of Sorvall Instruments company, after 5 minutes of centrifugation with 12000rpm, remove the settled solid component, obtain remaining in Carbon nanotube dispersion liquid in the upper part. The carbon nanotube dispersion liquid was analyzed by a particle size analyzer (Microtrac, S3500). As a result, the maximum value of the particle size distribution was 15 μm or less, and the average value was 2.8 μm. Here, dissolve 95.5g of ODA (Wakayama, Japan) and 12.9g of p-PDA (DuPont), add 87.7g of s-BPDA (Ube, Japan) and 65.0g of PMDA (DAICEL, Japan) , to manufacture semicon...
Embodiment 2
[0050] Mix 1480gDMF and 1.96g of carbon nanotubes (Bayer company, multi-walled carbon nanotubes of C150P) and 1.96g of Triton X-100 in a 2L capacity four-necked flask equipped with a mechanical stirrer, reflux condenser and nitrogen inlet (As a dispersant), let nitrogen flow in, disperse with 200W, 40kHz ultrasonic waves for 30 minutes, centrifuge at 12000rpm for 5 minutes in an RC5C centrifuge from Sorvall Instruments, remove the settled solids, and obtain the remaining The carbon nanotube dispersion in the section. The carbon nanotube dispersion liquid was analyzed by a particle size analyzer (Microtrac, S3500). As a result, the maximum value of the particle size distribution was 10 μm or less, and the average value was 1.3 μm. Here, 95.5g of ODA (Wakayama Corporation, Japan) and 12.9g of p-PDA (DuPont Corporation) were dissolved, and 87.7g of s-BPDA (Ube Corporation, Japan) and 65.0g of PMDA (DAICEL Corporation, Japan) were added. , to manufacture semiconductive polyamic a...
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