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Electroless copper plating solution

A technology of electroless copper plating and solution, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of slow plating speed, dull color of the coating, stagnation, etc., to achieve faster plating speed and brighter appearance. , the effect of increasing the thickness

Inactive Publication Date: 2012-09-26
深圳市新合富力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The coating color obtained by the existing electroless copper plating solution is dull, even without coating, and contains more cuprous oxide impurities, and the plating speed is extremely slow or even stagnant when the coating reaches 3-4 microns, and it is difficult to meet the requirements of the circuit board for the thickness of the coating. Require

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Electroless Copper Plating Solution:

[0031] CuSO 4 12g / L

[0032] Formaldehyde 10mL / L

[0033] Sodium Potassium Tartrate 15g / L

[0034] Disodium EDTA 25g / L

[0035] NaOH 10g / L

[0036] Na 2 CO 3 10g / L

[0037] Polyethylene glycol-700 0.1g / L

[0038] 2-2 cross-linked pyridine 20mg / L

[0039] 2-Mercaptobenzimidazole 3mg / L

[0040] FeSO 4 0.1g / L

[0041] Methanol 10mL / L

Embodiment 2

[0043] Electroless Copper Plating Solution:

[0044] CuSO 4 15g / L

[0045] Formaldehyde 15mL / L

[0046] Sodium Potassium Tartrate 15g / L

[0047] Disodium EDTA 25g / L

[0048] NaOH 12g / L

[0049] Na 2 CO 3 10g / L

[0050] Polyethylene glycol-700 0.1g / L

[0051] 2-2 cross-linked pyridine 20mg / L

[0052] 2-Mercaptobenzimidazole 1mg / L

[0053] FeSO 4 1g / L

[0054] Methanol 10mL / L

Embodiment 3

[0056] Electroless Copper Plating Solution:

[0057]CuSO 4 10g / L

[0058] Formaldehyde 12mL / L

[0059] Sodium Potassium Tartrate 15g / L

[0060] Disodium EDTA 25g / L

[0061] NaOH 12g / L

[0062] Na 2 CO 3 10g / L

[0063] Polyethylene glycol-1000 1g / L

[0064] 2-2 cross-linked pyridine 20mg / L

[0065] 2-Mercaptobenzimidazole 1mg / L

[0066] FeSO 4 1g / L

[0067] Methanol 10mL / L

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Abstract

The invention belongs to the field of electroless copper plating, in particular to electroless copper plating solution. The electroless copper plating solution comprises the following components in concentration: 5 to 20 grams per liter of copper salt, 5 to 15 milliliters per liter of formaldehyde, 25 to 65 grams per liter of complexing agent, 8 to 20 grams per liter of pH regulator, 5 to 20 grams per liter of pH buffer, 0.05 to 1 gram per liter of polyethylene glycol, 10 to 60 milligrams of 2-2 cross-linked pyridinoline, 1 to 20 milligrams per liter of 2-mercapto benzimidazole, 0.05 to 1 gram per liter of ferrite and 5 to 50 milliliters per liter of methanol. The electroless copper plating solution provided by the invention is used in an electroless copper plating process for directly metalizing a circuit board, and the formed plating has a bright appearance color and a low impurity content. The thickness of the plating is improved greatly to over 20 micrometers. The electroless copper plating solution can accelerate plating speed to over 10 micrometers per hour.

Description

technical field [0001] The invention belongs to the field of electroless copper plating, in particular to an electroless copper plating solution. Background technique [0002] Electroless plating copper, commonly known as sinking copper. It is a self-catalyzed redox reaction. During the electroless copper plating process, Cu 2+ The ions get electrons and are reduced to metal copper, and the reducing agent releases electrons to be oxidized itself. [0003] Electroless copper plating has no external power supply, and there is no resistance drop loss during electrolysis. Therefore, electroless copper plating is a very energy-efficient and efficient copper deposition process. In addition, electroless copper plating can be deposited on any non-conductive substrate. Based on the above benefits, electroless copper plating has been widely used in the field of circuit board manufacturing. [0004] At present, the development trend of circuit board production is the electroless ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40
Inventor 唐发德
Owner 深圳市新合富力科技有限公司
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