Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof

Abstract

The invention discloses encapsulation substrate unit bodies with plated through holes and a manufacturing method thereof. In one of metal layers of the substrate unit bodies, at least one drilling window is preformed at the preset drilling position, so that a drill point is only needed to drill insulating layers of the substrate unit bodies during mechanical drilling; therefore, the loss rate of the drill point can be reduced effectively, the service life of the drill point can be prolonged to reduce the cost of the mechanical drilling, and the frequency of replacing the drill point by machine halt can be reduced to improve the efficiency of the mechanical drilling. In addition, the heat energy generated by the drill point can be reduced effectively, and the radiating cooling demand of the drill point can be reduced to save the conventional heat conducting cover plate or reduce the using number of the conventional heat conducting cover plate, so that the material cost during the mechanical drilling is reduced, and the layer number of stacking the substrate unit bodies once is increased relatively.

Description

【Technical field】 [0001] The present invention relates to a packaging substrate unit body with plated through holes and its manufacturing method, in particular to a method for pre-forming the metal layer of the substrate unit body at the predetermined drilling position to form a drilling window to reduce drill pin loss A packaging substrate unit body with plated through holes and a manufacturing method thereof. 【Background technique】 [0002] Nowadays, in order to meet the needs of various high-density packaging, the semiconductor packaging industry has gradually developed various types of packaging structures, including many types of packaging structures, such as ball grid array (BGA) and pin array packaging structures. (pin grid array, PGA) or contact array package structure (land grid array, LGA), etc., are based on the packaging substrate (substrate) to implement the packaging structure. In the above packaging structure, at least one chip is carried on an upper surface ...

AI Technical Summary

Problems solved by technology

However, this will relatively prolong the cycle time of the drilling action, which is not conducive to improving production efficiency

In addition, the number of substrate units stacked each time has its limit, which limits the number of substrate unit stacks that can be processed in a single drilling operation, which is not conducive to improving the output per unit time (UPH)

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