Hybrid frequency-driven three-dimensional ellipse turning method

A three-dimensional, mixed frequency technology, applied in turning equipment, turning equipment, accessories of toolholders, etc., can solve the problems of difficult processing of ultra-precision parts, and achieve the effect of improving machinability

Active Publication Date: 2011-06-01
HUAWEI TEHCHNOLOGIES CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The invention provides a three-dimensional ellipse turning method driven by mixing frequency

Method used

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  • Hybrid frequency-driven three-dimensional ellipse turning method
  • Hybrid frequency-driven three-dimensional ellipse turning method
  • Hybrid frequency-driven three-dimensional ellipse turning method

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Embodiment Construction

[0025] figure 1 with figure 2 The three-dimensional motion generating device 3 and its arrangement on an ultra-precision lathe are shown respectively. Such as figure 1 with figure 2 As shown, the three-dimensional motion generation device 3 is installed on the Z-axis slide plate 4 of the lathe, the Z-axis slide plate is installed on the X-axis slide plate 5 of the lathe, and the X-axis slide plate 5 is installed on the bed 6. The linear grating displacement sensor 8a is installed on the X-axis sliding plate 5, the X-direction linear grating displacement sensor 8b is installed on the Z-axis sliding plate 4, the spindle angle encoder 7 is installed on the bed, and the diamond tool 9 is respectively connected to the X-axis piezoelectric The stack 10a, the piezoelectric stack 10b in the Y-axis direction, and the piezoelectric stack 10c in the Z-axis direction are fixedly connected, the piezoelectric stack 10a in the X-axis direction, the piezoelectric stack 10b in the Y-axis ...

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Abstract

The invention relates to a hybrid frequency-driven three-dimensional ellipse turning method, which belongs to the technical field of micro-nano ultraprecision cutting of free-form surfaces and cutting of materials difficult to machine. The method comprises the following steps of: driving a diamond cutter by using three piezoelectric stacking actuators along an X-axis direction, a Y-axis direction and a Z-axis direction respectively; applying a group of hybrid frequency driving signals onto each piezoelectric stacking actuator, wherein the hybrid frequency driving signal mainly comprises two components of which one is a sine wave signal for producing three-dimensional ellipse cutting and the other is a fast cutter servo signal for turning the generative free-form surfaces; matching amplitudes and phases of the three sine wave signals to make the diamond cutter produce three-dimensional ellipse turning movement at cutter position points; and driving the three piezoelectric stacking actuators to produce required fast cutter servo movement according to the disturbance components of projection components of a diamond cutter position point track on each coordinate axis respectively. The two kinds of turning movement can be independently controlled and optimized, so the method provided by the invention is simple, convenient and easy to implement.

Description

technical field [0001] The invention belongs to the technical field of micro-nano ultra-precision machining and free-form surface cutting of difficult-to-machine materials, and in particular relates to a three-dimensional ellipse turning method driven by mixing frequency. Background technique [0002] Ultra-precise parts with complex geometric features have a growing application demand in many important industrial fields. Diamond turning based on fast tool servo (FTS for short) is an important processing method for creating ultra-precision parts with complex geometry. It uses an FTS device to generate the fast reciprocating motion of the tool required for free-form surface creation. However, one of the main difficulties of this method is that the types of materials that diamond can cut are very limited. For ferrous materials such as hardened steel and hard and brittle materials such as silicon carbide, diamond has poor machinability, which often leads to severe tool wear, d...

Claims

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Application Information

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IPC IPC(8): B23B1/00
CPCB23B29/125B23B5/36B23B27/20B23B2260/108B23B2265/16
Inventor 周晓勤王刚林洁琼
Owner HUAWEI TEHCHNOLOGIES CO LTD
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