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Heat dissipation composite material

A composite material, uniformly dispersed technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of reducing the mechanical properties of polyimide such as flexibility, deteriorating the properties of finished products, etc.

Inactive Publication Date: 2013-02-13
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is still no relevant known technology that can simultaneously improve the thermal conductivity of the polyimide film and reduce or maintain its dielectric constant and dielectric loss
[0011] Another problem is that a certain proportion of inorganic filler particles necessarily reduces the mechanical properties of polyimide such as flexibility
Apparently, the surface potential energy catalyzed reaction above will degrade the finished product properties

Method used

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  • Heat dissipation composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Take 60g of silicon oxide (Nissonchemical / DMAc-ST) with a particle size between 10nm and 30nm, put it into a mixture of dimethylacetamide (hereinafter referred to as DMAc) and toluene dissolved in 0.06g to 12g of octadecanoic acid Solvent (v / v=70:30) allowed octadecanoic acid to deposit on the surface of silicon oxide, and the deposition result was confirmed by thermogravimetric analysis. After the above deposition, core-shell particles (SS-1 for short) with silicon oxide as the inorganic core and octadecanoic acid as the organic shell can be obtained. When 60g of silicon oxide is combined with 12g of octadecanoic acid, the thickness of the organic shell of the core-shell structure is between 2nm and 2.5nm.

[0035] The present invention can adopt the above conditions to replace octadecanoic acid with 4,4'-(hexafluoroisopropylidene)-bis(p-benzooxy)diphenylamine to form silicon oxide as the inorganic core and 4, 4'-(hexafluoroisopropylidene)-bis(p-benzooxy)diphenylamine...

Embodiment 2

[0038] Take 45g of alumina (Nippon Light Metal / LS-110F) with a particle size between 200nm and 1000nm, and put it into a mixed solvent of DMAc and heptane dissolved in 0.045g to 9g of cetyltrimethylammonium bromide (v / v=60:40), with zirconia beads for 24 hours of ball milling process, so that cetyltrimethylammonium bromide is deposited on the surface of alumina to form a suspension with a solid content of about 30% by weight , and the deposition results were confirmed by thermogravimetric analysis. After the above deposition, core-shell particles (AS-1 for short) with alumina as the inorganic core and cetyltrimethylammonium bromide as the organic shell can be obtained, and the weight ratio of the inorganic core to the organic shell is about 100: Between 1 and 100:1.5.

Embodiment 3

[0040] Take 65g of zinc oxide with a particle size between 300nm and 2000nm (Luchang Chemical / U.S. legal system), put 0.65g to 3.25g of 4,4'-(hexafluoroisopropylidene) phthalo In the mixed solvent (v / v=70:30) of N-methylrolidone (hereinafter referred to as NMP) of acid anhydride and heptane, the ball milling process was carried out with zirconia beads for 24 hours to make 4,4'-(hexa Fluoroisopropylidene) phthalic anhydride is deposited on the surface of zinc oxide to form a suspension with a solid content of about 30% by weight, and the deposition result is confirmed by thermogravimetric analysis. After the above deposition, the core-shell particle (ZS-1 for short) with zinc oxide as the inorganic core and 4,4'-(hexafluoroisopropylidene) phthalic anhydride as the organic shell (abbreviated as ZS-1) can be obtained, and the inorganic core and organic The weight ratio of the shell is about 100:1 to 100:1.5.

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Abstract

The invention provides a heat dissipation composite material and a preparation method thereof. Through the combination of core-shell filled particles with different particle diameters and different compositions, a polyimide film has high thermal conductivity as well as the electric property and flexibility of the polyimide film product.

Description

technical field [0001] The invention relates to a heat-conducting polyimide composite material, and particularly relates to the composition, ratio and particle size distribution of its core-shell filling particles. Background technique [0002] With the trend of light weight, thin and mobile electronic products, the packaging density of electronic products is becoming more and more integrated. In addition, the demand for functions is getting higher and higher, and the required driving power has been increasing, and the heat generated by the system has also risen linearly. How to maintain the stable operation of the electronic product system through good heat dissipation will become an important issue. The key point, polyimide resin is often used as the insulating layer of copper foil substrate materials because of its excellent heat resistance, mechanical properties and electrical properties. In order to respond to the trend of miniaturization and high-speed electronic produ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K9/10C08K3/34C08K3/22C08K3/28C08K3/38C08K3/14C08K3/08C09K5/00
Inventor 刘典谟吕常兴金进兴
Owner IND TECH RES INST